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HDI(High Density Interconnection)

HDI(High Density Interconnection)

HDI能够实现电子元器件信号的接受或发送的高密度互连板。 为贴装移动设备的主元件及转达信号而使用。

  • HDI<span>(High Density Interconnection)</span> 제품 01
  • HDI<span>(High Density Interconnection)</span> 제품 02
  • HDI<span>(High Density Interconnection)</span> 제품 03

General Features

  • 随着高集成化,增强产品性能
  • 容易实现PCB组装的自动化
  • 节省Total cost的效果

Application

  • Smart Phone, Note PC, Tablet, etc.

Why Samsung

SAVIA(SAMSUNG All layer VIA)能够发送通过PCB小型化及缩短信号路径的高速信号。

特点

All Layer Via(全层叠孔)是一种形成于全层(任意层)的产品,经过填孔电镀处理而形成,其传输性能及反射性均更优于Staggered Via(层间交错盲孔)。

Slim PCB

使用弹性模量高的薄材料而提高刚性,还使用低介电常数的材料,确保良好的电信号特性。

High Stiffness

使用弹性模量高的薄材料而提高刚性,提高Slim PCB的弯曲特性,(60 ㎛ CCL, 40/50 ㎛ Prepreg) 元件贴装质量得到改善

阻抗匹配

使用精细电路及Low Dk(低介电常数)材料,确保良好的电信号特性

Cavity Type

在贴装组件的部分区域形成阶梯状高度差的电路板。贴装厚组件时,也可减少整个厚度。

空腔式(Cavity Type)分为“无焊盘型”(Non Component Type)和“有焊盘型”(Component Type)两种,无焊盘型无法在腔体内贴装元件,而有焊盘型则可在腔体内形成用于贴装元件的SR及Pad。

Non Component Type

Reducing thickness of specific area

  • High Volume Manufacturing
  • Depth : ~ 400 ㎛
  • Application
    Wearable Device

Component Type

Reduce the thickness of an assembled device
※ HDI desing rules remain the same (0.4 Pitch)

  • Under Developing
  • Depth : ~ 250 ㎛
  • Application
    - Smart Phone
    - Tablet PC / Note PC

主要核心技术

通过将BGA/FCBGA技术融合/整合起来,努力开发HDI的薄型化及超微细线路技术。

Line-Up

关于All Layer及主要产品的产品系列。

  • Mass Production
  • Sample Available
HDI(HIGH DENSITY INTERCONNECTION) Line-Up
Type Mass Production Sample Available
Litho. Process Mass Production Sample AvailablemSAP
BGA Pitch Mass Production0.35 Sample Available0.35
Line width / space Mass Production30 / 40 Sample Available25 / 25
Via / Land Mass Production90 / 168 Sample Available70 / 150
Via Structure Mass Production Sample Available
Core Thickness Mass Production50 Sample Available40
Dielectric Thickness Mass Production25 Sample Available20
Total Thickness 8L Mass Production0.40 Sample Available0.35
10L Mass Production0.60 (12L 0.65T) Sample Available0.60
Dk / Df Mass Production Sample Available3.2 / 0.004

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 18213-I 2019-05-17 2021-08-19 Download
ISO 9001 & IATF 16949 IATF_91430-003 2018-01-08 2021-01-07 Download

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

论文

Journal of The Electrochemical Society, 157 (12) D620-D623 (2010) 2016-08-29 Admin Request

论文

Thesis_2010 APMT Advanced Polymeric Materials and Technology Symposium 2016-08-29 Admin Request

特许

[Patent] Patent No. : US 8258408 (2012.09.04) Electromagnetic interference noise reduction board using electromagnetic bandgap structure 2016-08-29 Admin Request