본문 바로가기
Package Substrate

Package Substrate是Mobile Device和PC用半导体封装载板,它扮演半导体和主板间传送电信号的角色。形成比普通电路板更精细的超高密度电路,可减少将昂贵的半导体直接贴装在主板时发生的组装不良率及成本。

FCCSP (Flip Chip-Chip Scale Package)

半导体芯片不是通过引线键合方式与基板连接,而是在倒装的状态下通过凸点与基板互连,因此而被称为“FCCSP”(Flip Chip Chip Scale Package)。 主要用于移动信息化设备的AP(Application Processor,应用处理器)芯片上。

  • FCCSP (Flip Chip-Chip Scale Package) 제품 01
  • FCCSP (Flip Chip-Chip Scale Package) 제품 02

General Features

  • High performance :将半导体Chip ↔ PCB间的距离
  • 降低最低,信号损失很少,可确保高性能
  • High I/O :得益于精细bump pitch,形成大量I/O

Application

  • Mobile Application Processor、Baseband等

Why Samsung

产品(技术)的特点及优点

与Wire bonding不同,在半导体(chip)上用Area Array形成Input / Output,翻转(Flip)后,与PCB进行连接。

与采用金线(Gold Wire)键合方式的WBCSP相比,FCCSP的电信号路径更短,生成更多输入/输出端(Input/Output),可适用于高密度半导体。

BSP

全球首次在量产阶段上使用BSP(Blue Stencil Printing)加工方法。

  • Available for fine bump pitch
  • Good for small bump risk
  • High productivity of bump processing
  • Competitive price by high productivity & high yield

EPS

EPS(Embedded Passive Substrate)是在电路板内安装被动元件的电路板。

Decoupling capacitor一般用来稳定power supply voltage level,如果把它安装在电路板内, 可减少Power / Ground network的Inductance。

ETS

ETS (Embedded Trace Substrate,内埋式线路基板)是线路图形被埋入绝缘基材里面的线路板。

ETS基板采用无芯(coreless)结构,无需增加成本,就可形成微细线路,易于进行“Layer down”设计(4L → 3L)。

蚀刻(etching)工艺不会影响到图形宽度,因此,可对线路宽度进行精密控制。

Line-Up

Line-up by Specification

  • Mass Production
  • Sample Available
Line-up by Specification
Mass Production Sample Available
Routing Density Build-up L/S Mass Production9 / 12 Sample Available10 / 10
BVH / Pad Registration Mass Production60 / 90 Sample Available60 / 85
SRO Dia. SR Registration Mass Production64 ± 15 Sample Available55 ± 10
FC Bump Pitch (Peripheral) Mass Production35 Sample Available30
FC Bump Pitch (Area) Mass Production130 Sample Available125
Low Z-Height Core / PPG Mass Production60 / 25 Sample Available40 / 25
Cu / SR Thickness Mass Production10 ± 5 Sample Available8 ± 4

Certificate

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 14001 20BK00223-UK 2016-06-25 2019-06-24 Download
ISO 50001 BK60004 2016-06-28 2019-06-27 Download
OHSAS 18001 BK50217 2016-06-25 2019-06-24 Download

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

论文

Thesis_Molecular dynamics study of thermal expansion of polymer 2016-08-29 Admin Request

论文

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish 2016-08-29 Admin Request

特许

[Patent]US 8039761 (2011.10.18) Printed circuit board with solder bump on solder pad and flow preventing dam 2016-08-29 Admin Request