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Package Substrate

Package Substrate是Mobile Device和PC用半导体封装载板,它扮演半导体和主板间传送电信号的角色。形成比普通电路板更精细的超高密度电路,可减少将昂贵的半导体直接贴装在主板时发生的组装不良率及成本。

SiP(System in Package)

将几个IC和Passive Component封装在一起成为一个系统,用该系统实现复合功能。

  • SiP(System in Package) 제품 01
  • SiP(System in Package) 제품 02
  • SiP(System in Package) 제품 03
  • SiP(System in Package) 제품 04

General Features

  • Smaller Package size compared to individually-packaged Ics
  • 散热特性

Application

  • PA(Power Amplifier), PAD(Power Amplifier Duplexer)
  • FEMID(Front-End Module with Integrated Duplexer)
  • SAW Filter, BAW Filter
  • Diversity FEM、Switch等各种RF配件

Why Samsung

可实现小型化及薄板。

小型化

多个IC及被动(无源)元件集成在一个模组上,可实现封装(Package)的小型化。

可实现薄板化

确保超薄板的驱动能力,可生成厚度为0.2毫米的基板(以六层为准)。

Coreless RF-SiP Substrate

使用Coreless加工方法,可生产Thin Substrate。

使用Coreless加工方法,可减少绝缘厚度,控制EMI(Electro Magnetic Interference)及 Parasitic Inductance提高信号特性。

Thin Ni ENEPIG

RF performance is possible based on the Ni thickness.

Bonding Pad의 Ni 두께를 기존 5~6.5㎛에서 0.1㎛로 감소하여 RF 특성을 개선하였습니다.

1) ENIG : Electroless Nickel Immersion Gold

2) ENEPIG : Electroless Nickel Electroless Palladium Immersion Gold

Selective ENEPIG

可在同一个面上进行异种表面处理。(ENEPIG + OSP)

1) OSP : Organic Solderability Preservative

Line-Up

Line up by Specification

  • Mass Production
  • Sample Available
SIP(SYSTEM IN PACKAGE) Line-Up
Layer Structure Cored Mass Production4L / 6L / 8L Sample Available4L / 6L / 8L
Coreless Mass Production5L / 7L Sample Available6L / 8L / 9L
Line / Space Mass Production25 / 25 ㎛ Sample Available20 / 30 ㎛
Bump pitch Mass Production150 ㎛ Sample Available130 ㎛
CuT Mass Production15 ㎛ Sample Available15 ㎛
Surface Finish Mass ProductionDirect Au, Thin ENEPIG Selective ENEPIG Sample AvailableDirect Au, Thin ENEPIG Selective ENEPIG

Product Series

  • TEV (Thermal Enhanced Via)
  • SSV (Solid Stack Via)
  • Flip-Chip SiP
  • Coreless

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 18213-I 2019-05-17 2021-08-19 Download