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Package Substrate

Package Substrate是Mobile Device和PC用半导体封装载板,它扮演半导体和主板间传送电信号的角色。形成比普通电路板更精细的超高密度电路,可减少将昂贵的半导体直接贴装在主板时发生的组装不良率及成本。

WBCSP(Wire Bonding Chip Scale Package)

用金线将半导体芯片与封装基板连接,半导体芯片的大小大于基板面积80%的产品通常被称为“WBCSP”(引线键合芯片尺寸封装)。 用金线将芯片与基板(PCB)连接,可实现多芯片封装(Multi packaging),而主要用于内存芯片上。尤其是,基板的最终厚度不超过0.13毫米的产品就被称为“UTCSP(Ultra Thin CSP,超薄芯片尺寸封装)”。

  • WBCSP(Wire Bonding Chip Scale Package) 제품 01
  • WBCSP(Wire Bonding Chip Scale Package) 제품 02

General Features

  • 轻薄短小(可制作厚度0.13 ㎜ 以下的薄板
  • 通过半导体chip size水平的封装实现最终产品的小型化)

Application

  • Mobile设备Memory

Why Samsung

可制作0.13㎜ 以下厚度的产品,因Chip to PCB Connection自由可实现Multi Chip Packaging,与相同厚度Package相比,能实现高性能。

Line-Up

Line-up by specification

General WBCSP road map of HVM / sample product

  • Mass Production
  • Sample Available
WBCSP(WIRE BONDING CHIP SCALE PACKAGE) Line-Up
Routing Density Bond Finger Mass Production65P (37 / 15, Ni 2) Sample Available60P (32 / 15, Ni 2)
L / S Mass Production50 pitch Sample Available40 pitch
SRO Dia. Tolerance Mass Production± 15 Sample Available± 10
Ball SR registration
(After Compensation)
Mass Production± 20 Sample Available± 17
Low Z-Height Thick.
Core / PGC
2Layer Mass Production80 Sample Available80
3Layer Mass Production80 Sample Available80
4Layer Mass Production135 Sample Available130

Line-up by structure

  • Mass Production
  • Sample Available
Line-up by structure
Core Layer Pattern Structure
Mass ProductionCored Mass Production2Layer Mass ProductionNormal
Mass ProductionCored Mass Production4Layer Mass ProductionNormal
Mass ProductionCoreless Mass ProductionSMS Mass ProductionNormal
Mass ProductionCoreless Mass Production2Layer Mass ProductionETS
Mass ProductionCoreless Mass Production3Layer Mass ProductionETS
Sample AvailableCoreless Sample Available4Layer Sample AvailableETS

※ ETS : Embedded Trace Structure

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 18213-I 2019-05-17 2021-08-19 Download