Best Paper Award
Samsung Electro-Mechanics' new-concept academic award — we support competent, young talents’ research activities.
Application Guideline
13th Awards (2017)
Eligibility
- Currently enrolled undergraduate/ graduate students or affiliated Post-docs who are capable of writing a thesis of pure or application technology related to engineering. (No restriction on major and nationality)
- Any paper submitted should not be published before October 13, 2017.(the due date of full paper submission)
2017 Field and Subject
| Field | Detailed Subject |
|---|---|
| Material Technology | Inorganic Material(Metal Material, Magnetic Material, Dielectric Material, Piezoelectric Material, Ceramic Material, Glass Material, Nano Material, Dielectric Thin Film, Metal Thin Film, and others),
Organic Material(Photosensitive Material, Binder Material, Insulating Material, Optical Material, Organic Synthesis, Chemicals, and others) , Composite Material |
| Device and Process Technology | Thin layer /Print(Laminate, sheet) Process, Thin Film Process, Printed Circuit Board Process(Plating, Circuit, Process, Bumping, and others), Surface Treatment(Plating, Etching, Cleansing, Exposure/Development),
MEMS Device(BAW Filter, SAW Filter, RF-Module, Microphone, and others), MEMS Process, PKG Design(structure), PKG Process (Advanced PKG, Wafer Level Package, Encapsulation, Wafer bonding, Interconnection, SMT, Die attach, Dicing, and others) |
| RF Technology & Software |
Analog/Mixed-Signal IC, Digital Design, RF Front-End IC (PA, LNA, Switch), RF Filter, Antenna, Wireless Power Transfer Algorithm, Image/Signal Processing, Computer Vision, Pattern Recognition, Machine Learning, Artificial Intelligence, Real-time/Embedded Systems, Operating Systems, Network Protocol, Network Security, Control Theory |
| Fundamental Technology | Nano Shape/Property Analysis, Surface and Interface Analysis, Developing New Nano-analysis Method using Atom Probe and Electron Microscope, Quantitative and Qualitative Analysis on Inorganic/Organic Chemicals, Macromolecule Characterization, Crystal Structure and Material Property Analysis, Developing Analysis Method on Local Area Property(ex. Nano Indenter), Infinitesimal Deformation/Stress Measuring Method,Laser Spectroscopy/Measurement/Processing,Failure Analysis and Reliability Improvement Technology of Micro Devices, Thermal and Fluid Flow Analysis, Structure/Vibration Analysis, Electromagnetic Field/RF/Circuit/EMI Analysis, Optical/Photonic Devices Analysis, Multi-physics(Plating Analysis, Corrosion Analysis, Etching Analysis, Chemical reaction Analysis) and Multi-scale Analysis, Material Analysis and Molecule Modeling, Nondestructure Analysis, Fault Isolation |
| Manufacturing Technology | Equipment Technology(Machine Design, Machine Control, Fluid Mechanics, Heat Transmission), Inspection/Measurement Technology(Electrical Measurement, Optical Measurement, Machine Vision, Temperature/Humidity, Vibration/Noise), Process Technology(Plating, Coating/Printing, Printed Electronics(Roll to Roll System),Laser Beam Machining), Manufacturing System((MES, Contamination/Particle/Static Electricity Control) |
Award in 2017
| Awards | ||
|---|---|---|
| Best Paper Award(1) | 10,000,000 \(KRW) | |
| Gold Medal(1) | 5,000,000 \(KRW) | |
| Silver Medal(4) | 3,000,000 \(KRW) | |
| Bronze Medal(5) | 1,000,000 \(KRW) | |
| Special Awards(1) | 3,000,000 \(KRW) | |
※ Special Award : This award will be given to laboratories which submit the most papers.
The Schedule of the Award in 2017
| Contents | Date |
|---|---|
| Abstract Submission | 17 July (Mon) ~ 6 September (Wed) |
| Selection Notification for Abstract | 29 September (Mon) |
| Paper Submission | 25 September (Mon) ~ 13 October (Fri) |
| Selection Notification for Paper | 31 October (Tue) |
| Presentation Contest | 8 November (Wed) |
| Awards Announcement | 13 November (Mon) |
| Awarding Ceremony | 17 November (Fri) |
Contact
- Samsung Electro-Mechanics Best Paper Award Secretariat
- E-mail :sem_thesis@samsung.com
12th Awards (2016)
Eligibility
- Currently enrolled undergraduate/ graduate students or affiliated Post-docs who are capable of writing a thesis of pure or application technology related to engineering. (No restriction on major and nationality)
- Any paper submitted should not be published before September 25, 2016.(the due date of full paper submission)
2016 Field and Subject
| Field | Detailed Subject |
|---|---|
| Material Technology | Inorganic Material(Metal Material, Magnetic Material, Dielectric Material, Piezoelectric Material, Ceramic Material, Glass Material, Nano Material, Surface treatment, Dielectric Thin Film, Metal Thin Film, and others), Organic Material(Polymers, Insulating Material, Optical Material, Organic Synthesis, Chemicals, and others) , Composite Material, Bezel Ink and Print, AF(Anti-Finger) Coating |
| Device and Process Technology | Thin layer /Print(Laminate, sheet) Process, Thin Film Process, Printed Circuit Board Process(Plating, Circuit, Process, Bumping, and others), Surface Treatment(Plating, Etching, Cleansing, Exposure/Development), MEMS Device(BAW Filter, SAW Filter, RF-Module, Accelerometer, Gyroscope, Pressure Sensor, Geomagnetic Sensor, Microphone, and others), MEMS Process, PKG Process (Wafer Level Package, Encapsulation, Wafer bonding, Interconnection, SMT, Die attach, Dicing, and others) |
| RF Technology & Software |
Analog/Mixed-signal IC, RF Front-End IC (PA, LNA, Switch, Filter 等), Antenna, SoC for wireless applications, Wireless power transfer, Wireless transceiver, Wireless Transceiver Architecture, MMIC Algorithm, Image/signal processing, Computer vision, Pattern Recognition, Machine Learning, Artificial Intelligence Real-time/Embedded Systems, Operating Systems, Network Protocol, Network Security, Control theory |
| Fundamental Technology | Nano Shape/Property Analysis, Surface and Interface Analysis, Developing New Nano-analysis Method using Atom Probe and Electron Microscope, Quantitative and Qualitative Analysis on Inorganic/Organic Chemicals, Macromolecule Characterization, Crystal Structure and Material Property Analysis, Developing Analysis Method on Local Area Property(ex. Nano Indenter), Infinitesimal Deformation/Stress Measuring Method, Laser Spectroscopy/Measurement/Processing, Failure Analysis and Reliability Improvement Technology of Micro Devices, Thermal and Fluid Flow Analysis, Structure/Vibration Analysis, Electromagnetic Field/RF/Circuit/EMI Analysis, Optical/Photonic Devices Analysis, Multi-physics(Plating Analysis, Corrosion Analysis, Etching Analysis, Chemical reaction Analysis) and Multi-scale Analysis, Material Analysis and Molecule Modeling |
| Manufacturing Technology | Equipment Technology(Machine Design, Machine Control, Fluid Mechanics, Heat Transmission), Inspection/Measurement Technology(Electrical Measurement, Optical Measurement, Machine Vision, Temperature/Humidity, Vibration/Noise), Process Technology(Plating, Coating/Printing, Printed Electronics(Roll to Roll System),Laser Beam Machining), Manufacturing System((MES, Contamination/Particle/Static Electricity Control) |
Award in 2016
| Awards | ||
|---|---|---|
| Best Paper Award(1) | 10,000,000 \(KRW) | |
| Gold Medal(1) | 5,000,000 \(KRW) | |
| Silver Medal(4) | 3,000,000 \(KRW) | |
| Bronze Medal(5) | 1,000,000 \(KRW) | |
| Special Awards(1) | 3,000,000 \(KRW) | |
※ Special Award : This award will be given to laboratories which submit the most papers.
The Schedule of the Award in 2016
| Contents | Date |
|---|---|
| Abstract Submission | 15 June (Wed) ~ 31 July (Sun) |
| Selection Notification for Abstract | 29 August (Mon) |
| Paper Submission | 29 August (Mon) ~ 25 September (Wed) |
| Selection Notification for Paper | 24 October (Mon) |
| Presentation Contest | 9 November (Wed) |
| Awards Announcement | 11 November (Fri) |
| Awarding Ceremony | 18 November (Fri) |
Contact
- Samsung Electro-Mechanics Best Paper Award Secretariat
- E-mail :sem_thesis@samsung.com
11th Awards (2015)
Eligibility
- Currently enrolled undergraduate/ graduate students or affiliated Post-docs who are capable of writing a thesis of pure or application technology related to engineering. (No restriction on major and nationality)
- Any paper submitted should not be published before September 16, 2015.(the due date of full paper submission)
2015 Field and Subject
| Field | Detailed Subject |
|---|---|
| Material Technology | Inorganic Material(Metal Material, Magnetic Material, Dielectric Material, Piezoelectric Material, Ceramic Material, Glass Material, Nano Material, and others), Organic Material(Polymers, Insulating Material, Optical Material, Organic Synthesis, Chemicals, and others) , Composite Material, Bezel Ink and Print, AF(Anti-Finger) Coating |
| Device and Process Technology | Thin layer /Print(Laminate, sheet) Process, Thin Film Process, Printed Circuit Board Process(Plating, Circuit, Process, Bumping, and others), Surface Treatment(Plating, Etching, Cleansing, Exposure/Development), MEMS Process, MEMS Device(Accelerometer, Gyroscope, Pressure Sensor, Microphone), Geomagnetic Sensor, Calibration technology, PKG Process (Wafer Level Package, Encapsulation, Wafer bonding, Interconnection, SMT, Die attach, Dicing, and others) |
| RF Technology | Analog/Mixed-signal IC, RF Front-End IC (PA, LNA, Switch, Filter 等), Antenna, SoC for wireless applications, Wireless power transfer, Wireless transceiver, Wireless Transceiver Architecture, MMIC |
| Software | Algorithm, Image/signal processing, Computer vision, Pattern Recognition, Machine Learning, Artificial Intelligence Real-time/Embedded Systems, Operating Systems, Network Protocol, Network Security, Control theory |
| Fundamental Technology | Nano Shape/Property Analysis, Surface and Interface Analysis, Developing New Nano-analysis Method using Atom Probe and Electron Microscope, Quantitative and Qualitative Analysis on Inorganic/Organic Chemicals, Macromolecule Characterization, Crystal Structure and Material Property Analysis, Developing Analysis Method on Local Area Property(ex. Nano Indenter), Laser Spectroscopy/Measurement/Processing, Failure Analysis and Reliability Improvement Technology of Micro Devices, Thermal and Fluid Flow Analysis, Structure/Vibration Analysis, Electromagnetic Field/RF/Circuit/EMI Analysis, Optical/Photonic Devices Analysis, Multi-physics and Multi-scale Analysis, Material Analysis and Molecule Modeling |
| Manufacturing Technology | Equipment Automation (Precise Motion Control, Structure Analysis, Flow Analysis, Heat Transmission), Measurement Technology(Electrical Measurement, Optical Measurement, Image Processing), Continuous Production(Roll to Roll System, Coating/Printing, Printed Electronics), Precision Process(Molding Design/Process, Laser Micro Processing), Manufacturing System(MES, Contamination/Particle Control, Cleaner Production) |
Award in 2015
| Awards | ||
|---|---|---|
| Best Paper Award(1) | 10,000,000 \(KRW) | |
| Gold Medal(1) | 5,000,000 \(KRW) | |
| Silver Medal(6) | 3,000,000 \(KRW) | |
| Bronze Medal(6) | 1,000,000 \(KRW) | |
| Special Awards(2) | 3,000,000 \(KRW) | |
※ Special Award : This award will be given to laboratories which submit the most papers and produce the most awardees.
The Schedule of the Award in 2015
| Contents | Date |
|---|---|
| Abstract Submission | 15 June (Mon) ~ 17 July (Fri) |
| Selection Notification for Abstract | 17 August (Mon) |
| Paper Submission | 17 August(Mon) ~ 16 September (Wed) |
| Selection Notification for Paper | 12 October (Mon) |
| Presentation Contest | 26 October (Mon) |
| Awards Announcement | 28 October (Wed) |
| Awarding Ceremony | 30 October (Fri) |
Contact
- Samsung Electro-Mechanics Best Paper Award Secretariat
- Tel : 82-2-735-1172
- E-mail :inside_edge@samsung.com
10th Awards (2014)
Eligibility
- Currently enrolled undergraduate/ graduate students or affiliated Post-docs who are capable of writing a thesis of pure or application technology related to engineering. (No restriction on major and nationality)
- Any paper submitted should not be published before October 2, 2014.(the due date of full paper submission)
2014 Field and Subject
| Field | Detailed Subject |
|---|---|
| Material Technology | Polymers, Ceramics, Composite Material, LTCC, Nano Material, Active/Passive Device Embedded Substrate Material, Magnetic Material, Dielectric Material, Glass Material, Metal Material, Piezoelectric Material, Thin Film Process, Printed Circuit Board Process(Plating, Circuit, Process, Bumping, and others), Bezel Ink and Print, AF(Anti-Finger) Coating |
| RF Technology | Analog/Mixed-signal IC, Digital IC, RF Front-End IC (PA, LNA, Switch), RF IC, Antenna, SoC for wireless applications, Wireless power transmission |
| Software | Computer Architecture, Real-time/Embedded Systems, Parallel/Distributed Systems,Operating Systems, Database, Algorithm, Network Protocol, Network Security,Signal Processing, Artificial Intelligence, Pattern Recognition, Machine Learning |
| Sensor&Module | MEMS Process, MEMS Device(Accelerometer, Gyroscope, Pressure Sensor, Microphone), Magnetometer , MEMS PKG, Structure/Vibration Analysis, Sensor Signal Process(ASIC), Calibration Technology, SNR, Actuator, Transparent Electrode Material and Process for Touch Sensor, Transparent Damp-proof Material, Glass Tempering and Machining Technology, Touch Sensor IC Design, New Feature of Touch Sensor, Pen Input Device, UI/UX Technology |
| Power Technology (Including Motor) | Power Electronics Technology for Display Power Applications and High Capacity/High Density SMPS, Thermal/EMI/Surge/Noise Design Technology, SMPS High Efficiency Topology and Control Technology, SMPS Simulation Technology, High Density Transformer Design Technology, Slim and High Density Power Technology, Digital Power Technology, Power ASIC Circuit Design, Power Semiconductor Design and Application Technology, Battery Management Technology, Motor Control Technology, PWM Algorithm, Inverter Design and Application Technology, Power Factor Correction(PFC) Circuit and Control Technology, DSP/MCU Application Technology |
| Fundamental Technology | Nano Shape/Property Analysis, Surface and Interface Analysis, Developing New Nano-analysis Method using Atom Probe and Electron Microscope, Quantitative and Qualitative Analysis on Inorganic/Organic Chemicals, Macromolecule Characterization, Crystal Structure and Material Property Analysis, Developing Analysis Method on Local Area Property(ex. Nano Indenter), Laser Spectroscopy/Measurement/Processing, Failure Analysis and Reliability Improvement Technology of Micro Devices, Thermal and Fluid Flow Analysis, Structure/Vibration Analysis, Electromagnetic Field/RF/Circuit/EMI Analysis, Optical/Photonic Devices Analysis, Multi-physics and Multi-scale Analysis, Material Analysis and Molecule Modeling |
| Manufacturing Technology | Equipment Automation (Precise Motion Control, Structure Analysis, Flow Analysis, Heat Transmission), Measurement Technology(Electrical Measurement, Optical Measurement, Image Processing), Continuous Production(Roll to Roll System, Coating/Printing, Printed Electronics), Precision Process(Molding Design/Process, Laser Micro Processing), Surface Treatment(Plating, Cleansing, Exposure/Development), Manufacturing System(MES, Contamination/Particle Control, Cleaner Production) |
Award in 2014
| Awards | ||
|---|---|---|
| '1nside Edge' Award(1) | 15,000,000 \(KRW) | |
| Gold Medal(1) | 7,000,000 \(KRW) | |
| Silver Medal(6) | 5,000,000 \(KRW) | |
| Bronze Medal(12) | 2,000,000 \(KRW) | |
| Special Awards(2) | 3,000,000 \(KRW) | |
※ Special Award : This award will be given to laboratories which submit the most papers and produce the most awardees.
The Schedule of the Award in 2014
| Contents | Date |
|---|---|
| Abstract Submission | 12 May (Mon) ~ 18 July (Fri) |
| Selection Notification for Abstract | 25 August (Mon) |
| Paper Submission | 25 August(Mon) ~ 2 October (Thu) |
| Selection Notification for Paper | 20 October (Mon) |
| Presentation Contest | 27 October (Mon) |
| Awards Announcement | 29 October (Wed) |
| Awarding Ceremony | 31 October (Fri) |
Contact
- 1nside Edge Paper Award Secretariat, Samsung Electro-Mechanics
- Tel : 82-2-735-1154
- E-mail :inside_edge@samsung.com
9th Awards (2013)
Eligibility
- Currently enrolled Undergraduate or Graduate students and affiliated Post-Docs who are capable of writing a pure or applied technical thesis related to engineering regardless of nationality
(No restriction on majors) - Any paper that has never been published before October 11, 2013
Field and Subject
| Field | Detailed Subject |
|---|---|
| Material Technology | Polymers, Ceramics, Composite Materials, LTCC, Nano, Active/Passive Device Embedded Substrate Material, Magnetic Material, Conductive Material, Glass Material, Metal Material, Piezo Material, Thin Film Process, Printed Circuit Substrate Process(Plating, Circuit, Process, Bumping, and others) |
| RF Technology | RF IC, Analog/Mixed signal IC, Digital IC, SoC for wireless applications, Wireless power transmission, Wireless communication system, PHY and MAC, Communication software |
| Sensor & Module | MEMS Process, MEMS Device(Accelerometer, Gyro Sensor, Pressure Sensor, Microphone), Geo-magnetic Sensor, MEMS PKG, Structure/Vibration analysis, Sensor Signal Process(ASIC), Calibration Technology, SNR, Actuator, Transparent Electrode Material and Process for Touch Sensor, Transparent Moisture-proof Material, Glass Strengthen and Process Technology, Touch Sensor IC Design, Touch Sensor New Feature, Pen Input Device, UI/UX Technology
Camera Module(Image Sensor Design, Evaluation, and Circuit Configuration, Optical Design and Instrumentation, Lenses and Lens mold Design, Image Processing) |
| Power Technology (Including Motor) |
Display Power Applications, High Power/High Density SMPS, Renewable Energy, Thermal/EMI/Surge/Noise Design Technology, Controller Design in Power Electronics, High Efficiency SMPS Topology, SMPS Simulation Technology, High Density Transformer Design, Slim and High Density Power, Digital Power, Power ASIC Circuit Design, Power Devices and Components Design, Battery Management, Motor Drive Design, Motor Control System, PWM Algorithm Design, Inverter Design and Application Tech., Power-factor Improvement Design, DSP/MCU Application Tech.
Brushless Motor Electromagnetic Design, Hydrodynamic Bearing Technology, Rotor Dynamic Technology |
| Fundamental Technology | Thermal/Fluid Dynamics Simulation, Structure/Vibration Simulation, Electro-Magnetics/RF/Circuit/EMI Simulation,Optoelectronic/Optomechanical Simulation, Multi-physics Simulation, Multi-scale Simulation, Molecular Dynamics Simulation, Nano-scale Structural Analysis, Quality and Quantitative Analysis of Organic/Inorganic Chemical, Characterization of Polymer, Crystal Structure and Property Analysis, Spectroscopy/Metrology/Machining with Lasers, Failure Analysis and Reliability Improvement of Micro Devices, Development of Atomic Force Microscope and Electro-mechanical Scope, and other new Nano Analysis Method. |
| Manufacturing Technology | Equipment Automization (Precise Motion Control, Structure Analysis, Flow Analysis, Heat Transmission), Measurement Technology(Electrical Measurement, Optical Measurement, Image Processing), Continuous Production(Roll to Roll System, Coating/Printing, Printed Electronics), Precision Process(Metal Molding Design/Process, Laser Micro Processing), Surface Processing(Plating, Cleaning, Exposure/Development), Manufacturing System(MES, Contamination/Foreign Substance Control, Cleaner Production) |
2013 시상
| Awarding | Awarding |
|---|---|
| '1nside Edge' Award(1) | 15,000,000 \(KRW) |
| Gold Medal(1) | 7,000,000 \(KRW) |
| Silver Medal(6) | 5,000,000 \(KRW) |
| Bronze Medal(12) | 2,000,000 \(KRW) |
| Special Awards(2) | 3,000,000 \(KRW) |
※ Special Awards : Award to the professors in the Laboratory which submitted the most papers and the Laboratory which are awarded the most.
Schedule in 2013
| Contents | Date |
|---|---|
| Abstract Submission | June 17(Mon) ~ August 9(Fri) |
| Selection Notification for Abstract | September 2(Mon) |
| Paper Submission | September 2(Mon) ~ October 11 |
| Selection Notification for Paper | November 4 (Mon) |
| Presentation Contest | November 18 (Mon) |
| Awards Announcement | November 20 (Wed) |
| Awarding Ceremony | November 22 (Fri) |
Contact
- 1nside Edge Paper Award Secretariat, Samsung Electro-Mechanics Corporation
- Tel : 02) 735-1175
- E-mail :삼성전기 inside Edge 논문대상 사무국으로 이메일 보내기inside_edge@samsung.com
8th(2012)
Eligibility
- Currently enrolled Undergraduate or Graduate students and affiliated Post-Docs who are capable of writing a pure or applied technical thesis related to engineering regardless of nationality
(No restriction on majors) - Any paper that has not been published before September 21, 2012
Overview
| Fields | Detailed Subject |
|---|---|
| Material Technology | Polymers, Ceramics, Composite Materials, LTCC, Nano, MEMS, Thin film Technology, Passive Components (L, R, C), Printed Circuit Boards (Material, Fabrication, Design, and etc.), Heat Radiating Substrate, Advanced Circuit Boards, Sensors, Magnetic Materials |
| RF Technology | Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and analysis, SoC for wireless application, Communication Software |
| Power Technology | Display Power Applications, High Power/High Density SMPS, Renewable Energy, Thermal/EMI/EMC Design Technology, Controller Design in Power Electronics, High Efficiency SMPS Topology, SMPS Simulation Technology, High Density Transformer Design, Slim and High Density Power, Digital Power, Power ASIC Circuit Design, Power Devices and Components Design, Battery Management, Motor Drive Design, Motor Control System, PWM Algorithm Design, Inverter Design and Application Tech., Power-factor Improvement Design, DSP/MCU Application Tech. |
| Fundamental Technology | Thermal/Fluid Dynamics Simulation, Structural Dynamics Simulation, Electro-Magnetics/RF Simulation, Optoelectronic/Optomechanical Simulation, Molecular Dynamics Simulation, Materials and Process Simulation, Multiphysics Simulation, Nano-scale Structural Analysis, Chemical Analysis of Organic and Inorganic Matters, Characterization of Synthetic Polymers, Deformulation of Multi-component Chemical Mixtures, Reverse Engineering of Electro-mechanical Components, Material Property Analysis, Crystallographic Analysis, Spectroscopy/Metrology/Machining with Lasers, Failure Analysis and Reliability Improvement of Micro Devices, Surface and interface Analysis, Reliability Assessment of Electro-mechanical Components |
| Manufacturing Technology | Electronic Packaging & Testing, Plating, Micro Contamination Control, Intelligent Control & Precision Automation, Optical System Design and Visual Inspection, High-precision Machining (Small Lens molding and Fine Forming) Printed Electronics & Roll to Roll (Printing, Coating and Web Handling) Manufacturing System (Production Scheduling, Yield Analysis, Manufacturing Simulation and MES) |
Awards
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & ￦10,000,000(KRW) | - Doctorate : If the winner joins Samsung Electro-Mechanics, will be offered the privilege of Post-Doc. Program for one year. - Bachelor/Master/Doctorate : The winner applicant will get extra points if applies to Samsung Electro-Mechanics. |
| Gold Medal (1 awards) | Medal & ￦5,000,000(KRW) | Bachelor/Master/Doctorate : The winner applicant will get extra points if applies to Samsung Electro-Mechanics. |
| Silver Medal (2 awards) | Medal & ￦3,000,000(KRW) | Bachelor/Master/Doctorate : The winner applicant will get extra points if applies to Samsung Electro-Mechanics. |
| Bronze Medal (6 wards) | Medal & ￦1,000,000(KRW) | Bachelor/Master/Doctorate : The winner applicant will get extra points if applies to Samsung Electro-Mechanics. |
| Special Awards | ￦3,000,000(KRW) | Award to the Laboratory which submitted the most papers |
Schedule
| Date | Contents |
|---|---|
| Abstract submission | May 14 2012 ~ June 29 2012 |
| Selection notification for abstract | July 13 2012 |
| Paper submission | July 16 2012 ~ Sep. 21 2012 |
| Selection notification for paper | Oct. 12 2012 |
| Thesis competition | 'Oct. 29 2012 |
| Awards announcement | Oct. 30 2012 |
Contact
- Samsung Electro-Mechanics in Korea
- Tel : 031)210-6867
- E-mail :Emailinside_edge@samsung.com
7th(2011)
Overview
| Fields | Detailed Subject |
|---|---|
| Material Technology | Polymers, Ceramics, Composite materials, LTCC, Nano, MEMS, Thin Film Processes, Printed Circuit Boards (Electroplating, Processing, bumping and etc.), Embedded passives/actives, SOFC, Supercapacitor, Sensor, Bio |
| RF Technology | Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and analysis, SoC for wireless application, Communication Software |
| Power Technology | Display Power Applications, High Power/High Density SMPS, Renewable Energy, Thermal/EMI/EMC Design Technology, Controller Design in Power Electronics, High Efficiency SMPS Topology, SMPS Simulation Technology in Power Electronics, High density Transformer Design, Slim and High Density Power, Digital Power, Power ASIC Circuit Design, Power Devices and Components Design, Battery Management, Motor Drive Design, Motor Control System, High Power Inverter |
| Fundamental Technology | Thermal/Fluid dynamics simulation, Structural dynamics simulation, Electro-magnetics/RF simulation, Optoelectronic/Optomechanical simulation, Molecular dynamics simulation, Materials and process simulation, Multiphysics simulation, Nanoscale structural analysis, Qualitative and quantitative chemical analysis of organic and inorganic matters, Characterization of synthetic polymers, Analysis of material properties and crystal structure, Spectroscopy/metrology/machining with lasers, Techniques for failure analysis and reliability improvement of micro devices, Surface and interface analysis, Reliability Assessment of Automotive Electronic Components |
| Manufacturing Technology | Electronics Packaging / Test, Plating, MCC(Micro Contamination Control), Yield/Failure Analysis, Visual Inspection, Intelligent Control, Precision Control(Position, Speed, Torque), Optical System Design and Metrology, Lens Molding, Precision Machining, Printed Electronics(Gravure printing, Inkjet printing), Manufacturing System (Production Scheduling, Yield Analysis, Manufacturing Simulation, MES), Laser Direct Imaging, Laser Trench |
Awards
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & ￦10,000,000(KRW) | - Doctorate : If the winner joins Samsung Electro
- Mechanics, will be offered the privilege of Post-Doc. Program for one year. - Master : support scholarship. |
| Gold Medal (1 awards) | Medal & ￦5,000,000(KRW) | - Doctorate/Master : Scholarship support |
| Silver Medal (2 awards) | Medal & ￦3,000,000(KRW) | - Doctorate/Master : Scholarship support |
| Bronze Medal (6 wards) | Medal & ￦1,000,000(KRW) | - Doctorate/Master : Scholarship support |
Schedule
- May 23 2011 ~ July 8 2011 : Abstract submission (please refer to Samsung web site www.sem.samsung.co.kr)
- July 22 2011 : Selection notification for abstract
- Sep. 30 2011 : Paper submission
- Oct. 21 2011 : Selection notification for paper
- Nov. 24 2011 : Thesis competition and awards announcement
Contact
- Samsung Electro-Mechanics in Korea
- Tel : 031)300-7835
- E-mail :Emailinside_edge@samsung.com
- Twitter : @SEMCOin
6th(2010)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Material Technology | Polymers, Ceramics, Composite materials, LTCC, Nano, MEMS, Thin Film Processes, Printed Circuit Boards (Electroplating, Processing, bumping and etc.), Embedded Passives/Actives, Supercapacitor, Bio |
| RF Technology | Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and analysis, SoC for wireless application, Communication Software |
| Power Technology | Display Power Applications, High Power/High Density SMPS, Renewable Energy, Thermal/EMI/EMC Design Technology, Controller Design in Power Electronics, High Efficiency SMPS Topology, SMPS Simulation Technology in Power Electronics, High density Transformer Design, Slim and High Density Power, Digital Power, Power ASIC Circuit Design, Power Devices and Components Design, Battery Management, Motor Drive, High Power Inverter |
| Fundamental Technology | Thermal/Fluid dynamics simulation, Structural dynamics simulation, Electro-magnetics/RF simulation, Optoelectronic/Optomechanical simulation, Molecular dynamics simulation, Materials and process simulation, Multiphysics simulation, Multiscale simulation Nano-scale surface analysis, Qualitative and quantitative chemical analysis of organic and inorganic matters, Characterization of synthetic polymers, Analysis of material properties and crystal structure, Spectroscopy/metrology/machining with lasers, Techniques for failure analysis and reliability improvement of micro devices, Instrumentation and analysis technique development at the nanoscale |
| Manufacturing Technology | Electronics Packaging / Test, Plating, MCC(Micro Contamination Control), Yield/Failure Analysis, Visual Inspection, Intelligent Control, Precision Control(Position, Speed, Torque), Optical System Design and Metrology, Lens Molding, Precision Machining, Printed Electronics(Gravure printing, Inkjet printing), Manufacturing System (Production Scheduling, Yield Analysis, Manufacturing Simulation, MES) |
Awards
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & ￦10,000,000(KRW) | - Doctorate : If the winner joins Samsung Electro
- Mechanics, will be offered the privilege of Post-Doc. Program for one year. - Master/Bachelor : Scholarship support. |
| Gold Medal (2 awards) | Medal & ￦5,000,000(KRW) | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (3 awards) | Medal & ￦3,000,000(KRW) | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (4 wards) | Medal & ￦1,000,000(KRW) | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Title and Abstract Submission Deadline
- >July 05. 2010
Contact
- Samsung Electro-Mechanics in Korea
- Tel : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
5th(2009)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Material | Polymer, Ceramics, Phosphor, Composites, Dielectrics, LTCC (Low Temperature Co-fired Ceramics), Nano, Dispersion, MEMS, Thin films, PCB Process, Embedded PCB, Solar Cell, Fuel Cell |
| Wireless | Analog & Digital IC Design, Wireless Communication Systems, Wireless Network Protocol Design and analysis, SoC for wireless application, Ad Hoc and Sensor Network |
| Power | Power Electronics Technology for Display Power/SMPS, Power Systems for Renewable Energy Conversion & Storage, Thermal / EMI/EMC Technology for Power System, High Efficiency Topology, Control/Modeling Technology, Power Circuit Modelling and simulation Technology, Integrated Magnetics design Technology for SMPS, Slim and High Power Density Technology for Power System, Digital Power electroncis technology and systems, Power ASIC Circuit Design technology |
| Fundamental Technology | Heat Transfer/Fluid Dynamics Simulation, Structural deformation/vibration simulation, Electro-magnetic field/RF/circuit/EMI simulation, Optics/Optical device simulation, material simulation, molecular modeling, Multi-Physics simulation, Multi-scale simulation, Nanostructural surface analysis, Organic and inorganic chemical analysis, Crystal structure analysis, Various materials (Polymer etc.) characterization, Laser spectroscopy/ meteorology/ machining, Microelectronic reliability and material qualification for microelectronic devices |
| Manufacturing Technology | Electronic Packaging and Test, Plating, MCC (Micro Contamination Control), Yield and Failure Analysis , Visually Inspection, Intelligent Control, Precision Control (Position, Velocity, Torque), Optical system design and instrumentation(for Image sensor module) , Lens design and molding, Nano machining (Ultraprecision mold & die technology, Molding technology for micro/nano structure) |
Award Details
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & $7,000 | - Doctorate : The winner will be offered the privilege of Post-Doc program one year, when the winner joins Samsung Electro-Mechanics
- Master/Bachelor : Scholarship support |
| Gold Medal (1 awards) | Medal & $5,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (1 awards) | Medal & $3,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (2 wards) | Medal & $1,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Title and Abstract Submission Deadline
- Jun 29. 2009
Contact
- Samsung Electro-Mechanics in Korea
- Tel. : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
4th(2008)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Photonics & Optics | Design and Analysis in Geometric optics/wave optics/photonics, Lighting Emitting Devices(LD/LED), Micro/adaptive Optic Devices, Optical Integration, Optics S/W, Image Signal Processing(S/W, H/W), Optical Sensor |
| Materials Technology | Polymer, Ceramic, Phosphor, Composites, Dielectrics, LTCC (low temperature co-fired ceramics), Nano, Dispersion, MEMS, Thin films, PCB Process, Embedded PCB, Solar Cell, Fuel Cell |
| RF Technology | Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and Analysis, SoC for Wireless Application, Communication Software, Antenna, Wireless Audio/Video, Broadcasting |
| Power Technology | Power Electronics Technology for Display Power/SMPS, Power Systems for Renewable Energy Conversion & Storage, Thermal / EMI/EMC Technology for Power System, High Efficiency Topology, Control/Modeling Technology, Power Circuit Modelling and simulation Technology, Integrated Magnetics design Technology for SMPS, Slim and High Power Density Technology for Power System, Digital Power Electroncis Technology and Systems, Power ASIC Circuit Design technology |
| Fundamental Technology | Heat Transfer/Fluid Dynamics Simulation, Structural Deformation/Vibration simulation, Electro-magnetic Field/RF/circuit/EMI Simulation, Optics/Optical Device Simulation, Material Simulation, Molecular Modeling(quantum Physics, Molecular Dynamics, Chemical reaction), Multi-Physics Simulation, Multi-scale Simulation, Nanostructural Surface Analysis, Organic and Inorganic Chemical Analysis, Crystal Structure Analysis, Various Materials (Polymer etc.) Characterization, Laser Spectroscopy/ Meteorology/ Machining, Microelectronic Reliability and Material Qualification for Microelectronic Devices, Advanced Analytical Techniques and Evaluation Methodology of Materials including SPM and an Electron Microscopy |
Award Details
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & $10,000 | - Doctorate : The winner will be offered the privilege of Post-Doc program one year, when the winner joins Samsung Electro-Mechanics - Master/Bachelor : Scholarship support |
| Gold Medal (2 awards) | Medal & $5,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (3 awards) | Medal & $3,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (5 wards) | Medal & $2,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Title and Abstract Submission Deadline
- Jun 30. 2008
Contact
- Samsung Electro-Mechanics in Korea
- Tel. : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
3th(2007)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Optic Technology | Design and Analysis in geometric optics/wave optics/photonics, Lighting emitting devices(LD/LED), Micro/adaptive optic devices, Optical Integration, Optics S/W, Image Signal Processing(S/W, H/W) |
| Materials Technology | Polymer, Ceramic, Phosphor, Composites, Dielectrics, LTCC (low temperature co-fired ceramics), Nano, Dispersion, MEMS, Thin films, PCB Process, Embedded PCB |
| RF Technology (including power) |
Analog & Digital IC Design, Wireless Communication Systems, MAC Design and analysis, Network Design and analysis, Communication Software, Antenna, Wireless Audio/Video, Broadcasting,Power Controller ASIC Design, High Density Power Technology, Digital Power Technology |
| Fundamental Technology | Heat Transfer/Fluid Dynamics Simulation, Structural Deformation / Vibration Simulation, Electro-magnetic field / RF / Circuit / EMI simulation, Optics / Optical device simulation, Material Simulation, Molecular Modeling(quantum physics, molecular dynamics, chemical reaction), Nanostructural Surface Analysis, Organic and inorganic chemical analysis, Crystal structure analysis, Various materials (Polymer etc.) characterization, Laser spectroscopy/ meteorology/ machining, Microelectronic reliability and material qualification for microelectronic devices, Advanced analytical techniques and evaluation methodology of materials including SPM and an electron microscopy |
| Manufacturing Technology | Electronic Packaging and Test, Plating, MCC (Micro Contamination Control) Technology, Yield and Failure Analysis , Visually Inspection, Intelligent Control, Precision Control (Position, Velocity, Torque), Optical system design and instrumentation(for Image sensor module) , Lens design and molding, Nano machining (Ultraprecision mold & die technology, Molding technology for micro/nano structure) |
Award Details
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & $10,000 | - Doctorate : The winner will be offered the privilege of Post-Doc program one year, when the winner joins Samsung Electro-Mechanics - Master/Bachelor : Scholarship support |
| Gold Medal (2 awards) | Medal & $5,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (3 awards) | Medal & $3,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (5 wards) | Medal & $2,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Contact
- Samsung Electro-Mechanics in Korea
- Tel. : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
2nd(2006)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Materials Technology | Polymer, phosphor, Composites, Dielectrics, LTCC (low temperature co-fired ceramics). Nano, Dispersion, MEMS, Thin films |
| RF Technology | Analog & Digital IC Design, Wireless Communication Systems(2G,3G,LAN,PAN,WAN..), MAC Design and analysis, Network Design and analysis, Communication Software, Antenna, Wireless Audio/Video, Broadcasting (DAB, DMB, DVB...) |
| Optic Technology | Design and Analysis in geometric optics/wave optics/photonics, Lighting emitting devices(LD/LED), Micro/adaptive optic devices, Optical Inatergration, Image Signal Processing |
| Fundamental Technology | Heat Transfer/Fluid Dynamics Simulation, Structural deformation/vibration simulation, Electro-magnetic field/RF/circuit/EMI simulation, Optics/Optical device simulation, Material simulation, Molecular modeling(quantum physics molecular dynamics, chemical reaction) Microstructure and extrinsic properties analysis of materials, Opto spectroscopic analysis and standardization related to optic properties measurement, Analysis technique and standardization relatedto optic properties measurement, Analysis technique and standardization related to environmental issues, Advanced analytical technique and evaluation of materials, Virtual Qualification & Physics of Failure, Reliability, Lab-on-a-chip Bio/Energy/Environment |
| Manufacturing Technology | Heat Transfer/Fluid Dynamics Simulation, Structural deformation/vibration simulation, Electro-magnetic field/RF/circuit/EMI simulation, Optics/Optical device simulation, Material simulation, Molecular modeling(quantum physics molecular dynamics, chemical reaction) Microstructure and extrinsic properties analysis of materials, Opto spectroscopic analysis and standardization related to optic properties measurement, Analysis technique and standardization relatedto optic properties measurement, Analysis technique and standardization related to environmental issues, Advanced analytical technique and evaluation of materials, Virtual Qualification & Physics of Failure, Reliability, Lab-on-a-chip Bio/Energy/Environment |
Award Details
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & $10,000 | - Doctorate : The winner will be offered the privilege of Post-Doc program one year, when the winner joins Samsung Electro-Mechanics
- Master/Bachelor : Scholarship support |
| Gold Medal (2 awards) | Medal & $5,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (3 awards) | Medal & $3,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (5 wards) | Medal & $2,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Contact
- Samsung Electro-Mechanics in Korea
- Tel. : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
1st(2005)
Applicant Requirement
- College and graduate students (including Post-Doc & Non-Korean)
Overview
| Fields | Detailed Subject |
|---|---|
| Fundamental Science | CAE, metallic moulds, precision machining or mechining or mechanical design, equipment design, Chemical analysis, Automation etc. |
| Materials & semiconductor processes | -Industrial Ink-Jet Printing (ink, head, process, analog device design) - High-k/low-k dielectric materials (ceramics/polymers), metallurgy & material science, glass frit
- Synthesis & composition of Phosphors - Dispersion technology - High-efficiency (LED) Packaging - Fine Patterning (Lithography process & plating) - Micro fabrication technology (MEMS) - Embedded system design |
| RF, Electrical & Electronic Engineering, Software | - Wireless LAN(Zigbee, UWB Modem technology), Bluetooth, RFID-related technology (including S/W)
- RFIC (Modem & RF Part) Design - Ultra-low power Design - Antenna design (CDMA, GSM) - Image sensor technology (CMOS/CCD Sensor, ISP, DSP) |
| Optical Engineering | - Geometric/diffractive optical system design (ultra-compact camera module design, display & general optical systems, lenses)
- High power LD/LED-related materials & processes - Image Signal Processing - Image Simulation - Micro Optics design/Adaptive Optics element - Optics Integration |
Award Details
| Awarding | Awarding | Advantage |
|---|---|---|
| '1nside Edge' Award(1 award) | Medal & $10,000 | - Doctorate : The winner will be offered the privilege of Post-Doc program one year, when the winner joins Samsung Electro-Mechanics
- Master/Bachelor : Scholarship support |
| Gold Medal (2 awards) | Medal & $5,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Silver Medal (3 awards) | Medal & $3,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
| Bronze Medal (5 wards) | Medal & $2,000 | Winners will be given extra credits when they apply for Samsung Electro-Mechanics |
Contact
- Samsung Electro-Mechanics in Korea
- Tel. : 031)300-7813
- E-mail :Emailinside_edge@samsung.com
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