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Next Generation Semiconductor Packaging Technology Panel Level Package Samsung Electro-Mechanics takes the lead!

  • Next generation Semiconductor Packaging Technology
    Panel Level Package
    Samsung Electro-Mechanics takes the lead!

  • What is Panel Level Package(PLP)?

    PLP is a next generation semiconductor packaging technology that enables semiconductors to be used in finished products without a Printed Circuit Board(PCB), which is what was traditionally required to connect semiconductors to the main board.

  • What is Panel Level Package(PLP)?

    PLP has the name Panel Level Package because it is manufactured by punching holes in a square panel and attaching the semiconductor DIE inside.
    So what are the advantages of PLP?

  • 1) Even thinner thickness

    The greatest advantage, smaller and thinner sizes!
    The thickness of electronic equipment decreases in the absence of a PCB.
    The functionality and battery size of electronic devices can also be enhanced by adding other components in the extra space.

  • 2) Enhanced heat dissipation

    Electronics heat up easily when used for a long time. Applying PLP technology enhances heat dissipation since the length of circuitry between input/output terminals is shorter.
    No more hot electronic devices!

  • 3) Suited for 5G

    Since shorter input/output terminal circuitry improves the transmission of electric signals as compared to using conventional PCB, the technology is also widely applicable in the 5G era that demands ultra-high speeds and ultra-low latencies.

  • 4) Scalability and flexibility

    PLP can embed more than two DIEs, allowing for more varied product designs.(Possible to embed two semiconductors!)

  • 5) An array of Samsung Electro-Mechanics’ technologies

    PLP includes all of the materials and manufacturing optimization technologies that Samsung Electro-Mechanics has accumulated so far.

    Flexibility can be enhanced for products meant to be strong against impacts, and integrated packaging that incorporates a variety of components can also be made.

  • Infinite potential of PLP

    The PLP has infinite potential as it is applicable to a variety of sectors, including power managing semiconductor PMIC, wireless communication RF chips, and the AP that is the brain of a modern smartphone.

    Samsung Electro-Mechanics will continue to research new technologies to establish new areas for growth in order to become the world’s best electronic components company!

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