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Wireless LAN

Wireless LAN is a wireless transmission and reception system for short-distance data in compliance with IEEE 802.11–based communication standards. It is also called “Wi-Fi.” As there is an increasing number of applications that require wireless LAN, such as smartphones, tablet PCs, and home appliances, there is a trend of shifting from a mono wireless LAN module to a combo module that can realize various communicaiton methods, such as Bluetooth, FM, and GPS, in a single package.

WiFi Combo Module

A Wi-Fi combo module is a short-distance wireless communication module that provides wireless Internet or communication between devices. Small and thin parts as well as a miniaturization package method are applied to provide high-density and miniaturized module solutions.

  • WiFi Combo Module
  • WiFi Combo Module

General Features

  • IEEE 802.11 a/b/g/n/ac Standard Compliant
  • Low Power Consumption
  • Compact Design
  • RoHS Compliant

Application

  • Smartphone, Tablet, Note PC
  • CE(Consumer Electronics)
  • Wearable Devices

Why Samsung

Features of Products (Technology)

WIFi new standard

Adoption of new standard technologies in advance to provide high-speed wireless communication

Optimization Design for high performance

Design optimization for high performance and low power–consumption characteristics

Dual side and Embedded package tecnhology

Application of high-density and miniaturization package methods

Short-distance wireless
communication technology
  • Matching between high-frequency transmision and reception to provide necessary communication speed and coverage
Complex / miniaturized
high-frequency circuit
design technology
  • High-density miniaturized wireless communication module
  • Designand analysis of high-density wiring for various DC power and digital interface signals, including high-frequency signals (signal integrity, power integrity)
  • Reduction of the characteristics of channels within a frequency band for securing stable communication speed and distance
High-frequency(RF)
signal processing
IC and matching technology
  • Application of high performance and low power–consumption characteristics of the high-frequency signal processing IC that amplifies and switches high-frequency signals
  • Matching of high-frequency input and output signals (high-frequency transmitting path and LC parts)
Miniaturization
package processing technology
  • Development of a process for a thin and miniaturized package (the ball gap is reduced as ICs get highly densed)
  • Package processing technology for the increase in the IC ball density and the parts mounting density

Structure View

Double-Sided Mounting Module Structure : A structure for mounting parts on the top and bottom surfaces

Dual sided package technology

Single-Sided Mounting Module Structure : A structure for mounting parts on the top surface

Single sided package technology

Line-Up

  11n Single-Band 11n Dual-Band 11n MIMO 11ac SISO 11ac MIMO

Broadcom

  • 11bgn (SDIO2.0)
  • BT4.0

Broadcom

  • 11abgn (SDIO3.0)
  • BT4.0

Qualcomm

  • 11abgn
  • BT4.0
 

Broadcom

  • 11abgn/ac(SDIO3.0)
  • BT4.0

Qualcomm

  • 11abgn/ac
  • BT4.0

Broadcom

  • 11abgn/ac 2x2 MIMO (PCI-E)
  • BT4.2

Qualcomm

  • 11abgn/ac 2x2 MIMO (PCI-E)
  • BT4.1
   

Qualcomm

  • 11abgn
  • 2x2, 3x3 MIMO
 

Broadcom

  • 11abgn/ac
  • 2x2 MIMO (USB 2.0)

Broadcom

  • 11bgn
  • BT4.1