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HDI(High Density Interconnection)

High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used for mounting the main parts of mobile devices and transmitting their signals.

  • HDI(High Density <span>Interconnection)</span>
  • HDI(High Density <span>Interconnection)</span>
  • HDI(High Density <span>Interconnection)</span>

General Features

  • Improves the performance of products because of high integration
  • Makes it easier to automate the assembly of PCBs
  • Reduces total costs

Application

  • Smart Phone, Note PC, Tablet, etc.

Why Samsung

SAVIA(SAMSUNG Any layer VIA)

The products allow transmission of signals at high speeds by making PCBs smaller and shortening the signal path.

Features

SAVIA is a product that has stack vias formed in all layers. Stack vias are formed through fill plating and have superb performance in terms of transmission and reflection than staggered vias.

SAVIA

Slim PCB

Stiffness is enhanced by using thin materials with high coefficient of elasticity. Electric signal characteristics are excellent as materials of low permitivity are used.

Slim PCB

High Stiffness

Stiffness is increased by applying materials with high coefficient of elasticity, and thereby improving the quality of partsmounting through the enhanced flex characteristics of slim PCBs (60 ㎛ CCL, 40/50 ㎛ Prepreg).

Slim PCB
Slim PCB

Impedance Matching

Electric signal characteristics are excellent as microcircuits and materials of low Dk (low permitivity) are applied.

Cavity Type

Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction in the overall thickness even if a thick component is mounted.

Cavity Type

There are two types of cavity: the non-component type which cannot mount component inside the cavity. and the component type which can mount components due to the formation of Sralc Pad.

Non Component Type

Reducing thickness of specific area

Cavity Type
  • High Volume Manufacturing
  • Depth : ~ 400 ㎛
  • Application
    Wearable Device
Cavity Type

Component Type

Reduce the thickness of an assembled device
※ HDI desing rules remain the same (0.4 Pitch)

Cavity Type
  • Under Developing
  • Depth : ~ 250 ㎛
  • Application
    - Smart Phone
    - Tablet PC / Note PC
Cavity Type

Pad type

Cavity Type

Realizes SMD PAD and NSMD PAD

adsizes are created based on each pitch according to the mounting methods and the needs of customers
- SMD : Solder Mask Defined
- NSMD : Non Solder Mask Defined

Cavity Type

Technology

- Able to form solder resister in the BGA Pad section
- Various materials such as PSR ink, Coverlay, Prepreg and others are used to form the register

Key Core Technologies

Develops slim and ultrafine circuit technologies of HDI through the convergence and integration of BGA/FCBGA technologies.

BGA

Line-Up

Line-UP of Any Layer and Main Products

  • Mass Production
  • Sample Available
HDI(HIGH DENSITY INTERCONNECTION) Line-Up
structure Via stack Line / Space Layer
2L 4L 6L 8L 10L 12L 14L 16L
MLB - - Mass Production0.3T ~ 1.2T Mass Production0.3T ~ 2.4T Mass Production0.43T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.88T ~ 2.4T Mass Production0.88T ~ 2.4T Mass Production0.88T ~ 2.4T
Staggered - 75/75 - Mass Production0.3T ~ 2.4T Mass Production0.43T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.65T ~ 2.4T Mass Production0.8T ~ 2.4T Mass Production1.2T ~ 2.4T -
- 50/50 (40/60) - Mass Production0.3T ~ 2.4T Mass Production0.43T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.65T ~ 2.4T - - -
Stack 2stack 75/75 - Mass Production0.3T ~ 2.4T Mass Production0.43T ~ 1.6T Mass Production0.6T ~ 1.6T Mass Production0.65T ~ 1.6T Mass Production0.65T ~ 1.6T - -
50/50 (40/60) - Mass Production0.3T ~ 2.4T Mass Production0.43T ~ 1.6T Mass Production0.6T ~ 1.6T Mass Production0.65T ~ 1.6T Mass Production0.65T ~ 1.6T - -
40/40 - - - Mass Production0.6T ~ 1.0T Mass Production0.65T ~ 1.2T Mass Production0.65T ~ 1.2T - -
3stack 75/75 - - Mass Production0.43T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.65T ~ 2.4T Mass Production0.65T ~ 1.6T - -
50/50 (40/60) - - Mass Production0.43T ~ 2.4T Mass Production0.6T ~ 2.4T Mass Production0.65T ~ 2.4T Mass Production0.65T ~ 1.6T - -
40/40 - - - Mass Production0.6T ~ 1.0T Mass Production0.65T ~ 1.2T Mass Production0.65T ~ 1.2T - -
30/40 - - - Sample available0.6T ~ 1.0T Sample available0.65T ~ 1.2T Sample available0.65T ~ 1.2T - -
Any Layer 75/75 - - Mass Production0.4T ~ 0.5T Mass Production0.5T ~ 0.7T Mass Production0.65T ~ 0.8T Mass Production0.8T ~ 1.6T - -
50/50 (40/60) - - Mass Production0.4T ~ 0.5T Mass Production0.5T ~ 0.7T Mass Production0.65T ~ 0.8T Mass Production0.8T ~ 1.6T - -
40/40 - - Mass Production0.4T ~ 0.5T Mass Production0.5T ~ 0.7T Mass Production0.65T ~ 0.8T Mass Production0.65T ~ 0.8T - -
30/40 - - Sample available0.4T ~ 0.5T Sample available0.5T ~ 0.7T Sample available0.65T ~ 0.8T Sample available0.65T ~ 0.8T - -

Certificate

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 20BK00223-UK 2016-06-25 2018-09-14 Download PDF 파일
ISO 50001 BK60004 2016-06-28 2019-06-27 Download PDF 파일
ISO 9001 & ISO/TS16949 TS_91430-003 2013-06-25 2016-06-24 Download PDF 파일
OHSAS 18001 BK50217 2016-06-25 2019-06-24 Download PDF 파일

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Thesis

Thesis_2010 APMT Advanced Polymeric Materials and Technology Symposium 2016-08-17 Admin Request

Thesis

Journal of The Electrochemical Society, 157 (12) D620-D623 (2010) 2016-08-17 Admin Request

Patent

[Patent] Patent No. : US 8258408 (2012.09.04) Electromagnetic interference noise reduction board using electromagnetic bandgap structure 2016-08-17 Admin Request