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HDI(High Density Interconnection)

High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used for mounting the main parts of mobile devices and transmitting their signals.

  • HDI(High Density <span>Interconnection)</span>
  • HDI(High Density <span>Interconnection)</span>
  • HDI(High Density <span>Interconnection)</span>

General Features

  • Improves the performance of products because of high integration
  • Makes it easier to automate the assembly of PCBs
  • Reduces total costs

Application

  • Smart Phone, Note PC, Tablet, etc.

Why Samsung

SAVIA(SAMSUNG All layer VIA)

The products allow transmission of signals at high speeds by making PCBs smaller and shortening the signal path.

Features

All Layer Via is formed across all layers through fill plating. Staggered Via is formed through transmission and reflection.

SAVIA

Slim PCB

Stiffness is enhanced by using thin materials with high coefficient of elasticity. Electric signal characteristics are excellent as materials of low permitivity are used.

High Stiffness

Stiffness is increased by applying materials with high coefficient of elasticity, and thereby improving the quality of partsmounting through the enhanced flex characteristics of slim PCBs (60 ㎛ CCL, 40/50 ㎛ Prepreg).

Slim PCB
Slim PCB

Impedance Matching

Electric signal characteristics are excellent as microcircuits and materials of low Dk (low permitivity) are applied.

Cavity Type

Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction in the overall thickness even if a thick component is mounted.

Cavity Type

There are two cavity types: noncomponent and component. Whereas the former type cannot be mounted with components, the latter has SRs and pads formed in a way that allows the mounting of components.

Non Component Type

Reducing thickness of specific area

Cavity Type
  • High Volume Manufacturing
  • Depth : ~ 400 ㎛
  • Application
    Wearable Device
Cavity Type

Component Type

Reduce the thickness of an assembled device
※ HDI desing rules remain the same (0.4 Pitch)

Cavity Type
  • Under Developing
  • Depth : ~ 250 ㎛
  • Application
    - Smart Phone
    - Tablet PC / Note PC
Cavity Type

Key Core Technologies

Develops slim and ultrafine circuit technologies of HDI through the convergence and integration of BGA/FCBGA technologies.

Line-Up

Line-UP of Any Layer and Main Products

  • Mass Production
  • Sample Available
HDI(HIGH DENSITY INTERCONNECTION) Line-Up
Type Mass Production Sample Available
Litho. Process Mass Production Sample AvailablemSAP
BGA Pitch Mass Production0.35 Sample Available0.35
Line width / space Mass Production30 / 40 Sample Available25 / 25
Via / Land Mass Production90 / 168 Sample Available70 / 150
Via Structure Mass Production Sample Available
Core Thickness Mass Production50 Sample Available40
Dielectric Thickness Mass Production25 Sample Available20
Total Thickness 8L Mass Production0.40 Sample Available0.35
10L Mass Production0.60 (12L 0.65T) Sample Available0.60
Dk / Df Mass Production Sample Available3.2 / 0.004

Certificate

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 20BK00223-UK 2016-06-25 2018-09-14 Download PDF 파일
ISO 50001 BK60004 2016-06-28 2019-06-27 Download PDF 파일
ISO 9001 & ISO/TS16949 TS_91430-003 2013-06-25 2016-06-24 Download PDF 파일
OHSAS 18001 BK50217 2016-06-25 2019-06-24 Download PDF 파일

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Thesis

Thesis_2010 APMT Advanced Polymeric Materials and Technology Symposium 2016-08-17 Admin Request

Thesis

Journal of The Electrochemical Society, 157 (12) D620-D623 (2010) 2016-08-17 Admin Request

Patent

[Patent] Patent No. : US 8258408 (2012.09.04) Electromagnetic interference noise reduction board using electromagnetic bandgap structure 2016-08-17 Admin Request