본문 바로가기

Package Substrate

The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

FCCSP (Flip Chip-Chip Scale Package)

This is called Flip Chip Chip Scale Package (FCCSP) as semiconductor chips are upturned and connected to a board through a bump rather than wire bonding. It is mainly used for the application processor (AP) chips of mobile IT devices.

  • FCCSP (Flip Chip-Chip Scale Package)
  • FCCSP (Flip Chip-Chip Scale Package)

General Features

  • High performance : High performance is realized through the minimization of the Chip ↔ PCB distance that results in less signal loss
  • High I/O : I/O is formed in large quantities due to microbump pitch

Application

  • Mobile Application Processor, Baseband and Others

Why Samsung

Features of Products (Technology)

Different from wire bonding, input and output are formed on the semiconductor (chip) through an area array, and then the chip is flipped and connected to the PCB

Feature of FCCSP

Compared to WBCSP using Gold Wire, the process using Flip Chip can be applied to high-density semiconductors because the route of electrical signals is shorter, and larger input and output can be accommodated.

Core Technology of FCCSP

BSP

For the first time in the world, BSP (Blue Stencil Printing) method is applied to mass production

  • Available for fine bump pitch
  • Good for small bump risk
  • High productivity of bump processing
  • Competitive price by high productivity & high yield

BSP(Blue Stencil Printing)

EPS

EPS (Embedded Passive Substrate) is a substrate that has an internally embedded semiconductor passive component.

EPS(Embedded Passive Substrate)

The decoupling capacitor is normally used to stabilize the power supply voltage level. When embedded inside a substrate, power ground/network inductance can be reduced.

EPS (Embedded Passive Substrate)
EPS (Embedded Passive Substrate)

ETS

Embedded Trace Substrate (ETS) is a circuit board whose circuit pattern is in the insulating material.

ETS has a coreless structure, which allows for the implementation of microcircuits without the need for additional cost. Layer Down is performed much easier (4L → 3L).

As the etching process is not affected by the pattern width, the circuit width can be precisely controlled.

Line-Up

Line-up by Specification

  • Mass Production
  • Sample Available
Line-up by Specification
Mass Production Sample Available
Routing Density Build-up L/S Mass Production9 / 12 Sample Available10 / 10
BVH / Pad Registration Mass Production60 / 90 Sample Available60 / 85
SRO Dia. SR Registration Mass Production64 ± 15 Sample Available55 ± 10
FC Bump Pitch (Peripheral) Mass Production35 Sample Available30
FC Bump Pitch (Area) Mass Production130 Sample Available125
Low Z-Height Core / PPG Mass Production60 / 25 Sample Available40 / 25
Cu / SR Thickness Mass Production10 ± 5 Sample Available8 ± 4

Certificate

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 20BK00223-UK 2016-06-25 2018-09-14 Download PDF 파일
ISO 50001 BK60004 2016-06-28 2019-06-27 Download PDF 파일
OHSAS 18001 BK50217 2016-06-25 2019-06-24 Download PDF 파일

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Thesis

Thesis_Molecular dynamics study of thermal expansion of polymer 2016-08-18 Admin Request

Thesis

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish 2016-08-18 Admin Request

Patent

[Patent]US 8039761 (2011.10.18) Printed circuit board with solder bump on solder pad and flow preventing dam 2016-08-18 Admin Request