The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.
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SiP(System in Package)
This product is developed by realizing complex functions into one system by mounting multiple ICs and passive components in a package.
Miniaturization and thin substrates are available.
Can realize small packages as multiple ICs and passive components are integrated into one module.
Can realize 0.2mm thin substrate (based on a 6-layer substrate) by securing the driving capability of ultrathin sheets.
Coreless RF-SiP Substrate
It can realize thin substrates by applying the coreless method.
Signal characteristics can be enhanced by controlling Electromagnetic Interference (EMI) and the parasitic inductance by lowering the insulation thickness through the application of the coreless method.
Thin Ni ENEPIG
RF performance is possible based on the Ni thickness.
1) ENIG : Electroless Nickel Immersion Gold
2) ENEPIG : Electroless Nickel Electroless Palladium Immersion Gold
Selective ENEPIG allows the treatment of different surface types on the same board. (ENEPIG + OSP)
1) OSP : Organic Solderability Preservative
Line up by Specification
- Mass Production
- Sample Available
|Layer Structure||Cored||Mass Production4L / 6L / 8L||Sample Available4L / 6L / 8L|
|Coreless||Mass Production5L / 7L||Sample Available6L / 8L / 9L|
|Line / Space||Mass Production25 / 25 ㎛||Sample Available20 / 30 ㎛|
|Bump pitch||Mass Production150 ㎛||Sample Available130 ㎛|
|CuT||Mass Production15 ㎛||Sample Available15 ㎛|
|Surface Finish||Mass ProductionDirect Au, Thin ENEPIG Selective ENEPIG||Sample AvailableDirect Au, Thin ENEPIG Selective ENEPIG|
- TEV (Thermal Enhanced Via)
- SSV (Solid Stack Via)
- Flip-Chip SiP
|Certification Standards||Certification No||Issue Date||Expiry Date||Certification|