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Package Substrate

The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

WBCSP(Wire Bonding Chip Scale Package)

This is a semiconductor chip the size of which is more than 80% of that of the finished part. It is called WBCSP (Wire Bonding CSP) as a gold wire bonding method is applied to connect the semiconductor chip and the PCB. As a separate bonding facility is used, the degree of freedom in the connection between the chip and the PCB is high, and chips can be stacked vertically, which makes the products mainly applicable for memory chips. In particular, the products that have a final substrate thickness of 0.13 ㎜ or thinner are called UTCSP(Ultra Thin CSP).

  • WBCSP(Wire Bonding Chip Scale Package) 제품 01
  • WBCSP(Wire Bonding Chip Scale Package) 제품 02

General Features

  • Ultraslim (Thin sheets that have a final thickness of 0.13 ㎜ or thinner can be produced. Final products can be produced smaller because of the chip-sized package).

Application

  • Mobile Equipment Memory

Why Samsung

Products can be produced with a thickness of 0.13 mm or less. As chip to PCB connections can be made freely, multichip packaging is possible and better performance is realized as compared to other products of the same thickness.

WBCSP

Line-Up

Line-up by specification

General WBCSP road map of HVM / sample product

  • Mass Production
  • Sample Available
WBCSP(WIRE BONDING CHIP SCALE PACKAGE) Line-Up
Routing Density Bond Finger Mass Production65P (37 / 15, Ni 2) Sample Available60P (32 / 15, Ni 2)
L / S Mass Production50 pitch Sample Available40 pitch
SRO Dia. Tolerance Mass Production± 15 Sample Available± 10
Ball SR registration
(After Compensation)
Mass Production± 20 Sample Available± 17
Low Z-Height Thick.
Core / PGC
2Layer Mass Production80 Sample Available80
3Layer Mass Production80 Sample Available80
4Layer Mass Production135 Sample Available130

Line-up by structure

  • Mass Production
  • Sample Available
Line-up by structure
Core Layer Pattern Structure
Mass ProductionCored Mass Production2Layer Mass ProductionNormal
Mass ProductionCored Mass Production4Layer Mass ProductionNormal
Mass ProductionCoreless Mass ProductionSMS Mass ProductionNormal
Mass ProductionCoreless Mass Production2Layer Mass ProductionETS
Mass ProductionCoreless Mass Production3Layer Mass ProductionETS
Sample AvailableCoreless Sample Available4Layer Sample AvailableETS

※ ETS : Embedded Trace Structure

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 BK60004 2016-06-28 2019-06-27 Download

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Patent

[Patent]Patent No. : US 2005-0194696 (2005.09.08) Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 2016-08-18 Admin Request