본문 바로가기

RF PCB

This substrate consists of a rigid substrate and a flex substrate, and the flexibility of the flex component allows for 3-D circuit connection to take place. As there is no need to use connectors between modules, this substrate is advantageous in terms of miniaturization. It is also possible to increase the degree of freedom in design by maximizing the set space utilization.

  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB
  • RF PCB

General Features

  • Flexibility: Withstands 150,000 times of continuous flexing, and 50 times of one-time flexing
  • High-density, thin, and various layer structures and designs

Application

  • Smart Phone, Tablet, Note PC, Wearable etc.
  • Display Module, Camera Module etc.

Why Samsung

Features of Products (technology)

3-D wiring

Equipment can be developed as compact and light, thanks to various types of 3-D wiring.

Rigid Flex Feature
Rigid Flex Feature
  • Flexible wire formation
  • Interlayer connection space excluded

Space Saving

When a rigid-flex PCB is used, the outer-layer FOB (FPCB on the board) area will not be needed, thereby reducing the substrate size. When the substrate size is reduced, the battery size can be increased and the bezel size can be reduced.

Rigid Flex Space Saving
Rigid Flex Space Saving

Key Core Technologies

ProducesHDI/BGA/FCB products and develops leading technologies as well as generate synergy through the convergence and integration of the technologies of individual products

Rigid Flex  All Layer
Rigid Flex Embedded

Line-Up

Applicable to various products, and the flex and the rigid can be combined in various ways in their layer count.

  • Mass Production
RIGID-FLEX Line-Up
Application Flex Layer
Count
Rigid Layer Count
3Layer 4Layer 6Layer 8Layer 10Layer 12Layer
Camera Module Camera module 2nd layer - Mass Production4-2-4 Mass Production6-2-6 - - -
- Mass Production4-2 - - - -
4th layer - Mass Production4-4-4 Mass Production6-4-6 - - -
Sub/Main Board sub/main board 2nd layer - Mass Production4-2-4 Mass Production6-2-6 Mass Production8-2-8 Mass Production10-2-10 -
3rd layer - - - - Mass Production10-3-10 -
4th layer - Mass Production4-4-4 Mass Production6-4-6 Mass Production8-4-8 Mass Production10-4-10 -
6th layer - - Mass Production6-6-6 Mass Production8-6-8 Sample Available10-6-10 -
8th layer - - - Mass Production8-8-8 - -
Flying Tail Flying Tail 1st layer Mass Production3-1 Mass Production4-1 Mass Production6-1 Mass Production8-1 Mass Production10-1 Mass Production12-1
- - - - Mass Production10-1-10-1 -
2nd layer - Mass Production4-2-4-1 Mass Production6-2-6-1 Mass Production8-2-8-1 - -
4th layer - - Mass Production6-4-6-1 Mass Production8-4-8-1 - -
6th layer - - - Mass Production8-6-8-1 - -
8th layer - Mass Production4-4-4-1 Mass Production6-6-6-1 Mass Production8-8-8-1 - -

Certificate

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 20BK00223-UK 2016-06-25 2018-09-14 Download PDF 파일
ISO 50001 BK60004 2016-06-28 2019-06-27 Download PDF 파일
OHSAS 18001 BK50217 2016-06-25 2019-06-24 Download PDF 파일

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Patent

[Patent]Patent No. : US 7802358 (2010.09.28) Rigid-flexible printed circuit board manufacturing method for package on package 2016-08-17 Admin Request