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"PLP leading to new form factor and unprecedented performance improvement ever"

PLP is technology fusion : Substrate technology + Semi-conductor technology

Vertical Integration

Stack via,
Back-side RDL

Scalability & Flexibility

Chip-First/Last,
Multi-die/Diverse size

Cool & Clean

Fast heat/Thicker die,
EMI Cu plating

Heterogeneous
Integration

Active/Passive,
RF/Analog/Mixed/Digital

5G Friendly

Small Size & Loss

Flat & Even

Material-Structure
balancing