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Package Substrate

Package Substrate是Mobile Device和PC用半导体封装载板,它扮演半导体和主板间传送电信号的角色。形成比普通电路板更精细的超高密度电路,可减少将昂贵的半导体直接贴装在主板时发生的组装不良率及成本。

FCBGA(Flip Chip Ball Grid Array)

将高集成半导体片和主板连接的高集成封装载板。 用倒装芯片凸点(Flip Chip Bump)将半导体芯片与封装基板互连,提高电气及热特性,生成高集成基板。

  • FCBGA(Flip Chip Ball Grid Array) 제품 01
  • FCBGA(Flip Chip Ball Grid Array) 제품 02
  • FCBGA(Flip Chip Ball Grid Array) 제품 03
  • FCBGA(Flip Chip Ball Grid Array) 제품 04

General Features

  • 主要适用于需满足高性能、高密度电路连接要求的封装(Package)领域
  • 电气及热特性得以提升

Application

  • PC, Server, TV, Set Top Box, Automotive, Game等

Why Samsung

通过多层、层间匹配提高Input / Output Signal,使得台式机、笔记本电脑、平板电脑CPU用电路板实现了高集成化。也可以减少Core厚度,实现薄板化,即UTC(Ultra Thin Core)或Coreless技术产品。

Line-Up

FCB有Standard Core、Thin Core、Coreless产品。

  • Mass Production
  • Sample Available
FCBGA(FLIP CHIP BALL GRID ARRAY) Line-Up
Core Thickness (㎛) Line width/space
Bump pitch
(Mass volume)
Layer
4L 6L 8L 10L 12L 14L 16L
Standard Core 800 9 / 12 ㎛ 130 ㎛ Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
700 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
400 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
Thin Core 250 13 / 14 ㎛ 130 ㎛ Mass Production Mass Production Sample Available
200 Mass Production Sample Available
100 Mass Production Sample Available

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 18213-I 2019-05-17 2021-08-19 Download

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

论文

Thesis_Molecular dynamics study of thermal expansion of polymer 2016-08-29 Admin Request

论文

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish 2016-08-29 Admin Request

论文

[Thesis]Design Analysis and optimization of Metal Core BGAs for Warpage 2016-08-29 Admin Request

论文

[Thesis]2011_ISTFA International symposium for testing and failure analysis (california_USA) 2016-08-29 Admin Request

特许

[Patent]Patent No. : US 8729395 (2014.05.20) Wire bonding joint structure of joint pad, and method for preparing the same 2016-08-29 Admin Request

特许

[Patent]US 8039761 (2011.10.18) Printed circuit board with solder bump on solder pad and flow preventing dam 2016-08-29 Admin Request

特许

[Patent]Patent No. : US 8563141 (2013.10.22) Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same 2016-08-29 Admin Request

特许

[Patent]Patent No. : US 2005-0194696 (2005.09.08) Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 2016-08-29 Admin Request

论坛

[Forum] Substrate for Packaging/Byungseung, Min chief/ April 13 2016-08-29 Admin Request

论坛

[Forum] The presnet and future of FC xGA / Youngsi, Choi director/ May 11 2016-08-29 Admin Request