SAVIA (SAMSUNG All layer VIA) allows for transmission of signals at high speeds by making PCBs smaller and shortening signal paths.

Features

All Layer Via is formed across all layers through fill plating. Staggered Via is formed through transmission and reflection.

Slim PCB

Stiffness is enhanced by using thin materials with high coefficient of elasticity. Electric signal characteristics are excellent as materials of low permitivity are used.

High Stiffness

Stiffness is increased by applying materials with high coefficient of elasticity, and thereby improving the quality of partsmounting through the enhanced flex characteristics of slim PCBs (60 ㎛ CCL, 40/50 ㎛ Prepreg).

Impedance Matching

Electric signal characteristics are excellent as microcircuits and materials of low Dk (low permitivity) are applied.

Cavity Type

Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction in the overall thickness even if a thick component is mounted.

There are two cavity types: noncomponent and component. Whereas the former type cannot be mounted with components, the latter has SRs and pads formed in a way that allows the mounting of components.

Non Component Type

Reducing thickness of specific area

• High Volume Manufacturing
• Depth : ~ 400 ㎛
• Application
  Wearable Device

Component Type

Reduce the thickness of an assembled device
※ HDI desing rules remain the same (0.4 Pitch)

• Under Developing
• Depth : ~ 250 ㎛
• Application
  - Smart Phone
  - Tablet PC / Note PC

Key Core Technologies

Develops slim and ultrafine circuit technologies of HDI through the convergence and integration of BGA/FCBGA technologies.

Line-UP of Any Layer and Main Products