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Package Substrate

The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

FCBGA(Flip Chip Ball Grid Array)

The product is a high-integration package substrate that is used to connect a high-integration semiconductor chip to a main board. This is a high-integration package substrate developed by connecting a semiconductor chip and a package substrate by using flip chip bumps.

  • FCBGA(Flip Chip Ball Grid Array) 제품 01
  • FCBGA(Flip Chip Ball Grid Array) 제품 02
  • FCBGA(Flip Chip Ball Grid Array) 제품 03
  • FCBGA(Flip Chip Ball Grid Array) 제품 04

General Features

  • Applicable for packages that require the connection of high performance and high density circuits
  • Enhances electric and thermal characteristics

Application

  • PCs, Server, TV, Set Top Boxe, Automotive, Game, etc.

Why Samsung

The CPU substrates for PCs are high and have multiple layers. They are produced with high density because of the increase of the input/output signals through the matching between the layers. Moreover, the substrates for notebook PCs and tablet PCs have a reduction in their core thickness, making them available in thin sheets like the UTC (Ultra Thin Core) and coreless products.

Core Technology of FCBGA

Line-Up

FCB is Available in Standard Core–, Thin Core–, and Coreless-Type Products

  • Mass Production
  • Sample Available
FCBGA(FLIP CHIP BALL GRID ARRAY) Line-Up
Core Thickness (㎛) Line width/space
Bump pitch
(Mass volume)
Layer
4L 6L 8L 10L 12L 14L 16L
Standard Core 800 9 / 12 ㎛ 130 ㎛ Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production
700 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
400 Mass Production Mass Production Mass Production Mass Production Mass Production Mass Production Sample Available
Thin Core 250 13 / 14 ㎛ 130 ㎛ Mass Production Mass Production Sample Available
200 Mass Production Sample Available
100 Mass Production Sample Available

Certificate

Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
Certification Standards Certification No Issue Date Expiry Date Certification
ISO 14001 KE191620 2019-06-10 2022-06-24 Download
ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
ISO 45001 KS19017 2019-06-10 2022-06-09 Download
ISO 50001 18213-I 2019-05-17 2021-08-19 Download

Technical Article

Technical Article 문서의 제목, 날짜, 등록자, 신청하기 등을 제공합니다.

Thesis

Thesis_Molecular dynamics study of thermal expansion of polymer 2016-08-18 Admin Request

Thesis

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish 2016-08-18 Admin Request

Thesis

[Thesis]Design Analysis and optimization of Metal Core BGAs for Warpage 2016-08-18 Admin Request

Thesis

[Thesis]2011_ISTFA International symposium for testing and failure analysis (california_USA) 2016-08-18 Admin Request

Patent

[Patent]Patent No. : US 8729395 (2014.05.20) Wire bonding joint structure of joint pad, and method for preparing the same 2016-08-18 Admin Request

Patent

[Patent]US 8039761 (2011.10.18) Printed circuit board with solder bump on solder pad and flow preventing dam 2016-08-18 Admin Request

Patent

[Patent]Patent No. : US 8563141 (2013.10.22) Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same 2016-08-18 Admin Request

Patent

[Patent]Patent No. : US 2005-0194696 (2005.09.08) Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same 2016-08-18 Admin Request

Forum

[Forum] Substrate for Packaging/Byungseung, Min chief/ April 13 2016-08-18 Admin Request

Forum

[Forum] The presnet and future of FC xGA / Youngsi, Choi director/ May 11 2016-08-18 Admin Request