"Next generation Panel Level Package (PLP)
technology into the processor...
Galaxy Watch for several days on a single charge."
PLP is technology fusion : Substrate technology + Semi-conductor technology
Vertical Integration
Stack via,
Back-side RDL
Scalability & Flexibility
Chip-First/Last,
Multi-die/Diverse size
Cool & Clean
Fast heat/Thicker die,
EMI Cu plating
Heterogeneous
Integration
Active/Passive,
RF/Analog/Mixed/Digital
5G Friendly
Small Size & Loss
Flat & Even
Material-Structure
balancing
