Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.
Under this agreement, Samsung Electro-Mechanics will reliably supply high-performance package substrates used in memory semiconductors to a global major customer for one year, from January 1, 2027 to December 31, 2027.
A package substrate is a core component that connects the semiconductor chip to the main board, transmits electrical signals, and supports the stable operation of the semiconductor. In particular, package substrates applied to high-performance semiconductors must support large-capacity data processing and high-speed signal transmission, requiring a high level of technology, including high integration and fine-circuit implementation.
Recently, the global semiconductor market has seen a rapid increase in demand for next-generation memory semiconductors such as high-bandwidth memory (HBM) and high-performance server DRAM modules, driven by the spread of generative AI and surging demand for high-performance computing (HPC). As memory semiconductors become faster and more highly integrated, package substrates that connect memory chips to the mainboard also require highly demanding process technologies such as high-layer-count structures, fine circuits, and ultra-thin designs.
Samsung Electro-Mechanics is recognized for the unrivaled technological capabilities and mass production stability it has accumulated in the package substrate field, including large-area fine-circuit implementation and warpage control technology.
With this agreement, Samsung Electro-Mechanics has expanded its long-term supply agreements across its core businesses. Following major long-term supply agreements in the Component Solution Unit for silicon capacitors, MLCCs for AI servers, and high-performance inductors since May this year, the company has also secured a large-scale order in the Package Solution Unit.
As a result, the long-term supply agreements signed by Samsung Electro-Mechanics since May 2026 have increased to seven in total, based on public disclosures (2.5% or more of sales), with the cumulative contract amount reaching KRW 4.3 trillion.
Samsung Electro-Mechanics plans to strengthen cooperation with major customers and expand long-term supply agreements to overcome volatility from business cycles and improve its business structure toward a stable, high-profit model.
Meanwhile, the importance of high-performance package substrates is growing further with the growth of the AI and high-performance computing markets. Accordingly, Samsung Electro-Mechanics plans to continuously enhance the competitiveness of its package substrate business by strengthening supply cooperation with customers and establishing a stable supply system.