Korea’s Largest Semiconductor Substrate Company
Package substrates are used for core semiconductors in mobile devices and PCs, transmitting electrical signals between
the semiconductor and the main board and protecting costly semiconductors from external stress. It is a high-density
circuit board containing more microcircuits than general substrates, which can reduce assembly defects and costs associated
with attaching expensive semiconductors directly to the main board.
Solutions
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- FCCSP
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It is connected to the substrate in an inverted position via
bumps rather than via wire bonding to the semiconductor,
and is primarily used for high-performance
semiconductors, such as APs (Application Processors)
in mobile IT devices.
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- WBCSP
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A product in which the semiconductor chip and
package substrate are connected by gold wire,
and the semiconductor chip size is greater than 80%
of the substrate area.
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- SiP
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A product that realizes complex functions as one system
by mounting multiple ICs and passive components in
a package and has heat dissipation characteristics.
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- FCBGA
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A high-density package substrate for connecting a
high-integration semiconductor chip to a main board.
The semiconductor chip and the package substrate
are connected with Flip Chip bumps.