SAMSUNG ELECTRO-MECHANICS

Samsung Electro-Mechanics will participate in the 'KPCA Show 2026' (International Semiconductor Substrate & Advanced Packaging Industry Exhibition) held at Songdo Convensia in Incheon from September 9 to 11, where it will showcase next-generation semiconductor package substrate technologies.

The 'KPCA Show' is Korea's leading exhibition where Korean and international companies in semiconductor substrates, packaging, materials, and equipment participate to share the latest technologies and market trends in the industry. It serves as a venue to exchange the latest technology trends in the semiconductor package and electronic circuit industries.

A semiconductor package substrate is a key component that connects highly integrated semiconductor chips to the mainboard, delivering electrical signals and power. As the performance of semiconductors such as AI accelerators and server CPUs rapidly improves and the adoption of high-performance memory expands, the status of the package substrate is also shifting — beyond simple interconnection, it has become a core technology that determines semiconductor performance, power efficiency, and signal stability.

In particular, AI semiconductors that integrate multiple high-performance chips into a single package require highly demanding technologies such as large-area, high-layer-count substrates, fine circuits, micro vias and bumps, and high-precision embedding.

At this exhibition, Samsung Electro-Mechanics will introduce next-generation package substrate technologies for a wide range of applications, from AI and servers to data centers, mobile, and autonomous driving, including ▲2.5D package substrates ▲2.1D package substrates ▲glass substrates ▲automotive FCBGA ▲UTCSP (Ultra Thin Chip Scale Package) substrates.

With the spread of generative AI, the computational performance of AI accelerators is increasing, leading to a surge in data input/output (I/O). As a result, substrates now require large-area, high-layer-count structures, high circuit density, and the ability to implement bumps at large scale.

Samsung Electro-Mechanics will introduce core technologies for 2.5D package substrates for AI accelerators, including technologies to reduce warpage in large-area, high-layer-count substrates, high-speed signal transmission, and high-density connection technologies.

The company will also present 2.1D package substrate technology, which enables direct connection between semiconductor chips without a silicon interposer. Through such fine circuit and high-density connection technologies, Samsung Electro-Mechanics is strengthening its competitiveness in the high-speed, high-density chip connections required for AI semiconductors.

As AI semiconductors become larger and more highly integrated, there is a growing need for substrate technologies that offer greater rigidity and dimensional stability, as well as improved signal, power, and thermal characteristics, compared to conventional organic material-based substrates.

Glass substrate technology applies glass as the core material to reduce warpage of the substrate and to secure signal characteristics and power efficiency while lowering the number of layers.

At this exhibition, Samsung Electro-Mechanics will introduce core glass substrate technologies, such as forming fine connection channels in glass material and filling them with metal, as well as precision surface processing technologies.

Samsung Electro-Mechanics' UTCSP substrates lead with a coreless structure that reduces substrate thickness and fine bond finger technology, meeting the demands for high integration and slimness in data centers and mobile devices.

The company will also exhibit UTC (Ultra Thin Core) package substrates used in CPUs such as those for laptops and tablets, as well as co-package substrates for smartphones.

Automotive package substrates require not only large-area, high-layer-count structures and fine circuit implementation, but also the reliability to withstand high temperatures, high humidity, and repeated temperature changes.

Accordingly, Samsung Electro-Mechanics is strengthening its competitiveness in package substrates for autonomous driving with high-function substrate technologies, including multi-chip structures, and reliability assurance technologies.

Choo Hyuck, Executive Vice President and Head of the Package Solution Unit at Samsung Electro-Mechanics, said, "As the high-performance semiconductor market for AI accelerators, servers, and autonomous driving grows, the role and technical difficulty of package substrates are also rapidly increasing. Samsung Electro-Mechanics will further advance its large-area, high-layer-count, ultra-fine circuit technologies and next-generation packaging technologies to respond to the high-end semiconductor package substrate market."