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Samsung Electro-Mechanics develops a semiconductor substrate (FC-BGA) for autonomous driving (ADAS)

▶Developed an automotive FCBGA applicable to advanced driver assistance systems (ADAS)
- Samsung Electro-Mechanics taps the automotive market to become the world's No. 1 automotive FCBGA company
▶Applied next-generation substrate technology such as microcircuit, large-size, and multi-layer techniques
- Implemented more than 10,000 bumps on a substrate the size of a passport photo
▶Expanding the automotive product lineup to target the high-end market
- Entered the autonomous driving semiconductor market after becoming the first Korean company to release server products


Samsung Electro-Mechanics announced on February 26 that it developed an automotive semiconductor substrate (FCBGA) applicable to advanced driver assistance systems (ADAS), and will expand its lineup of high-end automotive semiconductor substrates. 


The newly developed FCBGA is a substrate for high-performance autonomous driving (ADAS) systems and is one of the most technically challenging products among automotive products.

Samsung Electro-Mechanics plans to supply this product to global customers and target the electric vehicle market with the aim to become the global No. 1 company in high-end automotive semiconductor substrates.


Today's autonomous vehicles require SoC (System on Chip) equipped with high-performance semiconductors for advanced technology.

Therefore, an autonomous driving system requires a high-performance and high-reliability semiconductor substrate that can optimize the performance of the semiconductor so that it can process large amounts of data at high speed without latency, and can operate reliably without problems even in extreme driving conditions.


In addition, the more advanced the semiconductor function for high-performance autonomous driving is, the higher the number of packaged semiconductor chips and CPU cores per chip, so the semiconductor substrate becomes large and multi-layered, and the number of bumps also increases.


Samsung Electro-Mechanics has newly applied its microcircuit technology acquired in high-end IT products such as servers to automotive products, reducing the circuit width and spacing by 20% compared to the existing substrate (for partial autonomous driving) and implementing more than 10,000 bumps in a limited space the size of a passport photo.


The company also secured product reliability by increasing the substrate size to respond to multi-chip packages and improving the bending strength according to the increase in the number of layers.

※Multi-chip package: A package that mounts several semiconductor chips on a single substrate to improve semiconductor performance.


Moreover, automotive semiconductors used in automobiles are directly related to safety, so a high level of reliability is required to ensure safe operation in harsher environments (high temperature, high humidity, impact, etc.) than IT products. In addition, as the level of autonomous driving increases, the performance and reliability of semiconductors used in vehicles become crucial, further underscoring the importance of semiconductor substrates.


The new product obtained AEC-Q100 certification, which is a reliability test standard for automotive electronic parts, and can apply to all fields from the vehicle body and chassis to infotainment and autonomous driving.


Kim Eungsoo, Executive Vice President of the Package Solution Unit at Samsung Electro-Mechanics, said, “As the demand for high-end, high-performance semiconductors continues, FCBGA is becoming the key to differentiating semiconductor performance. Samsung Electro-Mechanics will continue to discover core manufacturing technologies based on our FCBGA technology leading the global market to increase quality competitiveness and expand our automotive FCBGA market share by expanding production capacity.” 


Since starting the package substrate business in 1991, Samsung Electro-Mechanics has been supplying products to major companies around the world as a leader in the substrate industry. Among them, the company has the largest market share in its flagship semiconductor package substrates for mobile APs as well as the world's most advanced substrate technologies, such as becoming the first in Korea to develop FCBGA for servers, which is the most technologically challenging semiconductor substrate.


Samsung Electro-Mechanics is strengthening its lineup of automotive products based on technological prowess in implementing multi-layer, large-size, and microcircuit products and has newly established an organization dedicated to electric vehicles in major business units in an effort to expand the share of automotive products in its core businesses such as semiconductor substrates, camera modules, and multilayer ceramic capacitors (MLCC).


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