Founded in 1973, Samsung Electro-Mechanics has developed and produced core electronic components, increasing the competitiveness of the Korean electronics industry and growing into a partner of global electronics, IT and automobile companies. Let's look back on what happened in August in the history of Samsung Electro-Mechanics since 1973.
1973ㅣ Completion of an electronic parts factory at the beginning of establishment
As Samsung Electro-Mechanics (then Samsung-Sanyo Parts) completed the construction of its new plant on September 25, equipment for the tuner and DY/FBT divisions of Samsung Electronics and Samsung Sanyo Electro-Mechanics was moved at the end of October.
The construction of the Samsung-Sanyo Parts plant began on May 19, 1973, when the company was ready to be set up as it signed a joint venture agreement with Japan's Sanyo Electric and submitted an application for permission for foreign investment to the government. The first factory spanning about 6,600m² was built in an area of about 27,700m² at 314 Maetan-dong, Suwon-si, and was completed at the end of October.
1984ㅣWon the 1st National Productivity Award (top company in the electronic parts sector)
Samsung Electro-Mechanics engaged in various IE(Industrial Engineering) activities such as standard time and man-hour management, support for productivity improvement team activities, promotion of on-site improvement activities through productivity training, and facility efficiency management. In October 1984, the company won the grand prize at the 1st National Productivity Award hosted by the Korea Productivity Center, and achieved productivity improvements of 12.1% and 23.5% in 1987 and 1988, respectively.
1994ㅣSigning ceremony to build a joint factory in Tianjin, China
On October 6, 1993, the company agreed to establish a joint venture named Tianjin Samsung Electro-Mechanics Co., Ltd. with Tianjin No.5 Radio Components Factory, and held a signing ceremony with the city of Tianjin. This provided a production base in the capital region of China and marked the second entry to the Chinese market after the Dongguan plant.
The products manufactured were tuners for TVs and VTRs, drums for VTRs, and motors, and later expanded to FBT and aluminum electrolytic capacitors by additionally installing equipment after the completion of the factory.
1997ㅣOperation of a production plant dedicated to BGA substrates
As part of the expansion and promotion of new businesses, a BGA(Ball Grid Array) substrate plant was completed on October 13, 1997, at the Jochiwon plant (currently Sejong plant). Construction began in April 1997, and the plant built on a total floor area of 2,600m² was then capable of producing 10,000m² of BGA substrates per month.
2004ㅣ0.11mm thick semiconductor package substrate
Samsung Electro-Mechanics succeeded in commercializing the world's thinnest 0.11mm-thick semiconductor package substrate, laying the groundwork for becoming No. 1 in the global semiconductor substrate market. The ultra-thin semiconductor substrate was a cutting-edge product that could house up to eight layers of high-performance semiconductors such as flash memory and SRAM. Now, as for mass production standards, it is 80μm for thin plates and 1.3mm for thick plates.
2011ㅣDeveloped the world's highest capacity 2.2uF 0603 MLCC
In 2011, Samsung Electro-Mechanics developed the world's first 2.2uF 0603 (width 0.6mm, length 0.3mm) MLCC that can be used at a voltage of 6.3V. "0603" was the most rapidly growing ultra-small standard among all MLCC standards, and the new product achieved a 2.2-fold increase in capacity while maintaining the ultra-compact size. This allowed Samsung Electro-Mechanics to be technologically ahead of its competitors by more than a year in the ultra-small and ultra-high-capacity MLCC sector. Today, Samsung Electro-Mechanics produces MLCCs for advanced driver assistance systems (ADAS) and the world's highest capacity MLCCs for 5G smartphones through continuous research and development.
2013ㅣ Developed the world's highest-performance camera module
Samsung Electro-Mechanics developed the world's highest-performance 13-megapixel optical image stabilizer (OIS) camera module that doubled the image stabilization performance of smartphones. This product enabled smartphone users to take clearer photos even in dark places with long exposure. Although the OIS function was added to Auto Focus, the camera's power consumption was reduced as much as possible to reduce the increase in battery consumption.