go to the gnb menu go to the content
Press Release 2022.09.20

Samsung Electro-Mechanics unveils next-generation semiconductor package technology at KPCA Show 2022

▶Showcases the latest high-performance, high-integration, ultra-slim semiconductor package substrates for 5G, AI, and automobiles
- Unveils a highly complex product with 4x in size and 2x in the number of layers than general products, as well as an ultra-slim substrate with a thickness reduced by 50% using coreless technology
▶Secures unparalleled competitiveness with System on Substrate (SoS), a next-generation package substrate
- Since the end of last year, the company has made a cumulative investment of 1.9 trillion won in semiconductor package development.


KPCA 삼성전기 전시부스 3D도면

KPCA 삼성전기 전시부스 3D도면

Samsung Electro-Mechanics will participate in KPCA Show 2022 to unveil its next-generation semiconductor package technology.

The KPCA Show (International Electronic Circuits and Packaging Show), Korea's largest circuit board exhibition that brings together substrate, material, and equipment manufacturers from home and abroad, will be held from September 21 to 23 at Songdo Convensia, Incheon.


At the show, Samsung Electro-Mechanics, the largest semiconductor package substrate company in Korea, is revealing its technological prowess by exhibiting high-performance, high-integration, and ultra-slim next-generation semiconductor package substrates.


A semiconductor package substrate connects a highly integrated semiconductor chip and a mainboard to transmit electrical signals and power. Substrates for high-performance semiconductors used for 5G, AI, and automobiles require advanced techniques that can increase the number of layers, implement microcircuits, achieve granular inter-layer consistency, and make products thinner to reduce the set thickness. 


KPCA 삼성전기 전시부스 내부 3D도면

One of the highlights is high-performance FCBGA (Flip-chip Ball Grid Array) including FCBGA for servers.

FCBGA, in which the semiconductor chip and package substrate are connected in a flip chip method, is a highly integrated package substrate with improved electrical and thermal properties. The high-spec product is mostly used for central processing units (CPU) and graphics processing units (GPU) that exchange a lot of electrical signals. Among them, the FCBGA for dual servers is known to require the most complex technology.

The FCBGA for servers is a particularly complex product, which is about 75mm x 75mm in size (area), which is 4 times that of general FCBGA, and has 20 or more internal layers, which is twice that of general products, designed to process high-speed signals. The product will be in production by the end of the year.


Samsung Electro-Mechanics is also showcasing ultra-small high-density semiconductor substrates for mobile IT devices. FCCSP (Flip Chip Chip Scale Package), a product that reduced the thickness by 50% compared to existing products with a coreless method that removes the core (inner support layer) inside the semiconductor substrate, and SiP (System in Package) in which several semiconductor chips and passive components such as MLCC are embedded in a package substrate, will also be on display.


Chang Duckhyun, CEO of Samsung Electro-Mechanics, said, "The next-generation package substrate will become a platform that integrates all systems."

System on Substrate (SoS), unveiled by Samsung Electro-Mechanics at the show, is a package substrate using an ultra-miniaturization process to implement an integrated system by arranging two or more semiconductor chips on a substrate. In general, SoC (System on Chip) refers to the integration of semiconductors such as CPU and GPU into one chip and involves difficulties such as limitations in implementing miniaturization of different semiconductors and utilization of space.

SoS is a next-generation substrate technology that improves semiconductor performance by placing different semiconductor chips on a single substrate and connecting them with a fine rewiring technique. 


삼성전기 반도체 패키지기판 제품사진

Samsung Electro-Mechanics, which started its circuit board business in 1991, has become an industry leader that supplies products to global companies with differentiated technology. In the sector of semiconductor package substrates for high-end mobile APs, Samsung Electro-Mechanics has maintained its unrivaled leadership in terms of market share and technology.

Samsung Electro-Mechanics has been intensively developing semiconductor package substrates by making a cumulative investment of 1.9 trillion won since the end of last year, in a proactive effort to maintain the "super-gap" technology. Samsung Electro-Mechanics is focusing on fostering the semiconductor package substrate business and strengthening its competitiveness based on its original manufacturing technology, dedicated facilities, and core technologies to build ultra-slim, large-area, multi-layered, parts-integrated, and microcircuit products.

Related Articles

Online Museum TOP