- ▶The first production of the most technically challenging product among package substrates at the Busan plant
- - High-performing semiconductors for 5G, AI, and cloud require high-performance package substrates
- - The company’s core source technologies such as embedding and fine process control enable various applications
- - The shipment ceremony was held at the Busan plant
Samsung Electro-Mechanics has become the first in Korea to develop and mass-produce Flip-Chip Ball Grid Array (FCBGA) for servers. To commemorate the first shipment, a shipment ceremony was held at the Busan plant on November 8.
FCBGA is a semiconductor package substrate applied to high-performance semiconductors, such as CPU (Central Processing Unit) and GPU (Graphic Processing Unit) for servers, and can be used in various applications requiring high-performance and high-density circuit connection.
If the package substrate for PC is compared to an apartment building, FCBGA for servers is compared to building a skyscraper with more than 100 floors. For server CPU/GPU, multiple semiconductor chips need to be mounted on a single substrate to respond to the high performance of semiconductors, such as improved computing power and connection signal speed. Therefore, FCBGA for servers requires product reliability and production yield management in accordance with the bigger size and multiple layers of substrates (more than 4 times the area of the PC package substrate and more than 2 times the number of layers). This makes FCBGA a difficult area for latecomers to enter.
"In the paradigm shift of industries such as servers, AI, cloud, metaverse, and automobiles, package substrates are becoming a key factor to differentiate semiconductor performance due to the requirements for high-performance semiconductors," said Chang Duckhyun, CEO of Samsung Electro-Mechanics. "We will create new business opportunities based on our world-class technological prowess, and will leap forward as a 'top-tier tech' components company based on innovative technology."
The package substrate market is expected to see growing demand for high-end products in the industrial and automotive markets, such as 5G antennas, Arm CPU, and servers/automobiles/networks.
Samsung Electro-Mechanics, which started the substrate business in 1991, is leading the substrate industry by supplying products with differentiated technology to the world's leading companies. In particular, the company holds the unrivaled No. 1 market share and technology in semiconductor package substrates for high-end mobile APs.
Samsung Electro-Mechanics has proactively made a large-scale investment of 1.9 trillion won since the end of last year in a bid to maintain its "super-gap" technology in semiconductor package substrates. Furthermore, the company is concentrating its capabilities on strengthening its competitiveness in the package substrate business, such as developing next-generation substrate technology through ultra-miniaturization processes such as System on Substrate (SoS).