go to the gnb menu go to the content


  • When you go to the Contact us on the main page or the Product page, you can ask questions about technologies and purchases by each region.  

  • Samsung Electro-Mechanics is able to respond to all types of surface processing, including OSP, ENIG, ENEPIG, ENIG+EG, and EPIG.  

  • Mainly, we carry out the gilding process with electrolytic Ni/Au, ENIG, and ENPIG, and electrolytic Ni/Au can be categorized into thick Ni/Au and thin Ni/Au. 

  • As the market leader, we provide various technological solutions for key clients in the mobile market with regards to mobile AP FCCSP. Memory MDRAM, Flash, and eMCP/eMMC FBGA began with 0.22T CSP circuit boards in the early 2000s, and now, we provide 0.13T or lower UT-CSP and 3-or-more-layer build-up products. 

  • The indication of an effective date differs by each certification institution. One certification institution, BSI, focuses on whether the certification has been renewed and evaluated regardless of the effective date on the certification. That is, even if an effective date is listed on the certification, it does not imply that all certifications are effective until that date, but instead must be continuously evaluated to maintain its certification. On the other hand, in the case where the certification effective date is a requirement, such as TS/TL, the certification effective date is indicated as such. Should an effective date confirmation certification be necessary, BSI sends officially issued documents. 

  • RoHS is a guideline regarding the regulated usage of six types of toxic substances (Pb, Cd, Cr6+, Hg, PBB, PBDE), and Pb Free is a regulation only for Pb.
    In other words, RoHS can be said to include Pb Free. The Pb Free regulation has been in effective since a few years ago, and RoHS has been in effect in the EU since July 1, 2006. If you satisfy RoHS, then you will certainly satisfy Pb Free. 

  • BGA is an acronym for Ball Grid Array and is used mainly in packaged circuit boards. This is used to electrically connect the semiconductor with the mainboard, and unlike the previous lead frame (external connection line), it is embedded using a solder ball, allowing for the connection of multiple I/O.  

  • This is to protect the semiconductor from the external environment, including external shocks or moisture, and simultaneously allow for the input and output of electrical signals, connecting to external sockets. 

  • Embedded PCB is a method that embeds a part inside the PCB when it is normally installed on top of the PCB, and because the distances between various active/passive elements are shortened, the interference of signals decreases, making it advantageous for high-speed products.  

  • Both methods are additive engineering methods used to form fine patterns, but there is a difference between the Seed Cu formation method and Seed Cu removal method.
    - SAP : It uses chemical Cu (within 1μm) as its seed and removes the seed with flash etching after pattern gilding 
    - mSAP : It uses Cu laminate (1.5~2μm)+ chemical Cu as its seed and removes the seed with quick etching 

For more information, please submit a customer inquiry, and our C/S representative will get back to you.

Go to Inquiry
Online Museum TOP